US2006237097A1PendingUtilityA1

Immersion method

Assignee: ROHM & HAAS ELECT MATPriority: Apr 20, 2005Filed: Apr 20, 2006Published: Oct 26, 2006
Est. expiryApr 20, 2025(expired)· nominal 20-yr term from priority
H10W 90/756H10W 72/07511H10W 72/01571C23C 22/74H05K 3/282C23C 22/08H05K 3/244C23C 22/82H05K 2203/0789C23F 11/167C25D 5/48C23C 22/07
39
PatentIndex Score
0
Cited by
0
References
0
Claims

Abstract

A composition and method for inhibiting corrosion is disclosed. Metals and metal alloys are treated with compositions which contain inorganic and organic acids that prevent oxide formation on the metals and metal alloys.

Claims

exact text as granted — not AI-modified
1 . A composition consisting essentially of one or more phosphoric acids or salts thereof in amounts to inhibit oxide formation on metals and metal alloys.  
     
     
         2 . The composition of  claim 1 , wherein the one or more phosphoric acids comprise inorganic phosphoric acids, or organic phosphoric acids.  
     
     
         3 . The composition of  claim 2 , wherein the organic phosphoric acids comprise alkylphosphoric acids, hydroxyalkyldiphosphoric acids, hydroxyalkylenephosphoric acids, hexaalkylenediamino-tetra(alkylene-phosphoric) acids, aminotris(alkylene-phosphoric) acids, or phosphorocarboxylic acids.  
     
     
         4 . A composition consisting of one or more inorganic phosphoric acids or salts thereof, one or more organic phosphoric acids or salts thereof, and water.  
     
     
         5 . A method comprising contacting a metal or metal alloy with a composition comprising one or more phosphoric acids or salts thereof to inhibit oxidation of the metal or metal alloy.  
     
     
         6 . A method comprising: 
 a) depositing one or more metals or metal alloys on a substrate;    b) contacting the one or more metals or metal alloys with a composition comprising one or more phosphoric acids or salts thereof; and    c) reflowing the one or more metals or metal alloys.    
     
     
         7 . The method of  claim 6 , wherein the one or more metals or metal alloys are deposited on the substrate electrolytically.  
     
     
         8 . The method of  claim 6 , wherein the metal is tin, or the metal alloy is a tin alloy.  
     
     
         9 . The method of  claim 6 , wherein the substrate is a printed wiring board, lead frame or connector.

Join the waitlist — get patent alerts

Track US2006237097A1 — get alerts on status changes and closely related new filings.

We store only your email — no account needed. See our privacy policy.