Heat disspiating system and device
Abstract
The present invention discloses a heat dissipating system and device. The heat dissipating system includes a compressor having two pipelines; a heat dissipating for connecting a first combining tube of one of the two pipelines from the compressor, a plurality of heat dissipating fins disposed between the first combining tube and a second combining tube with the same shape of the first combining tube for defining a multilayer channel with the internal sides of the first and second combining tubes, two pipelines connected externally and separately to the second combining tube; an expansion valve; and an evaporator. The compressor is used for dispersing the heat of a conductive medium of a cooling fluid to conduct the heat of a heat source and lower the temperature of the heat source, so as to enhance the heat dissipation and performance of the heat dissipating system.
Claims
exact text as granted — not AI-modified1 . A heat dissipating system, comprising:
a compressor, having two pipelines disposed separately on a side of said compressor; a heat dissipating device, for connecting a first combining tube of one of said two pipelines from said compressor and defining a multilayer channel by the internal sides of said first combining tube and a second combining tube with the same shape of said first combining tube and a plurality of heat dissipating fins, and said second combining tube having two pipelines separately and externally coupled to said second combining tube; an expansion valve, having an end coupled to said pipeline of said second combining tube of said heat dissipating device and said pipeline coupled to said expansion valve; and an evaporator, having an inlet disposed at an end and coupled to said pipeline on said expansion valve and an outlet disposed at another end and coupled to another pipeline of said second combining tube of said heat dissipating device to define a circulated heat dissipating channel.
2 . A heat dissipating device, comprising:
a plurality of heat dissipating fins, having an upper and a lower circuits, and said upper and lower circuits are not interconnected; two combining tubes, engaged with said plurality of heat dissipating fins; a horizontal partition, disposed in the middle of said two combining tubes and defining an upper space and a lower space; a connecting pipe, disposed separately at upper and lower opposite corners of said two combining tubes, a plurality of embedding holes, disposed at an external side of said two combining tubes, a plurality of rectangular holes, disposed at an internal side, such that said plurality of embedding holes and said plurality of rectangular holes engage a plurality of vertical partitions with said plurality of heat dissipating fins; and a cover, disposed separately at an end of said two combining tubes.
3 . The heat dissipating device of claim 2 , wherein said combining tube is an ellipsoid.
4 . The heat dissipating device of claim 3 , wherein said combining tube is a tetrahedron and has a cover disposed at a distal end of said combining tube.
5 . The heat dissipating device of claim 2 , wherein said vertical partition has a side with the shape of an air pipe.
6 . The heat dissipating device of claim 5 , wherein said vertical partition has a circular hole thereon.
7 . The heat dissipating device of claims 2 or 4 , wherein said cover has a protruded member disposed at one side and coupled with said upper and lower spaces of said two combining tubes.Join the waitlist — get patent alerts
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