Method for fabricating a monolithic fluid injection device

Abstract

A method for fabricating a monolithic fluid injection device. The method includes providing a substrate with a patterned sacrificial layer thereon. Next, a patterned support layer and a patterned resistive layer, as a heating element, are formed on the substrate sequentially. A patterned insulating layer having a heating element contact via and a first opening is formed on the support layer. A patterned conductive layer is formed on the support layer and fills the heating element contact via as a signal transmitting circuit. A patterned protective layer having a signal transmitting circuit contact via and a second opening corresponding to the first opening is formed on the substrate. A manifold is formed by wet etching the back of the substrate to expose the sacrificial layer. A chamber is formed by removing the sacrificial layer in the wet etching process. Finally, an opening connecting the chamber is formed by etching the support layer along the second opening.

1 - 13 . (canceled)  
   
   
       14 . A method for fabricating a monolithic fluid injection device, comprising the steps of: 
 providing a substrate having a first surface and a second surface;    forming a patterned sacrificial layer on the first surface of the substrate;    forming a patterned structure layer on the first surface of the substrate and covering the patterned sacrificial layer;    forming a patterned resistive layer on the structure layer as a heater;    forming a patterned insulating layer on the structure layer, the patterned insulating layer having a heater contact opening, wherein the heater contact opening exposing at least part of the heater;    forming a patterned conductive layer overlying the structure layer and connecting the heater via the heater contact opening to form a signal transmitting circuit;    forming a patterned protective layer overlying the substrate and covering the insulating layer and the conductive layer;    forming a fluid channel in the second surface of the substrate, opposing the first surface, and exposing the sacrificial layer;    removing the sacrificial layer to form a fluid chamber; and    etching the protective layer, the insulating layer, and the structure layer to form an orifice connecting the fluid chamber.    
   
   
       15 . The method as claimed in  claim 14 , wherein the patterned protective layer further comprises a signal transmitting circuit contact opening, the signal transmitting circuit contact opening exposing at least part of the signal transmitting circuit.  
   
   
       16 . The method as claimed in  claim 15 , wherein the signal transmitting circuit contact opening and the orifice are formed simultaneously.  
   
   
       17 . A method for fabricating a monolithic fluid injection device, comprising the steps of: 
 providing a substrate having a first surface and a second surface;    forming a patterned sacrificial layer on the first surface of the substrate;    forming a patterned structure layer on the first surface of the substrate and covering the patterned sacrificial layer;    forming a patterned resistive layer on the structure layer as a heater;    forming a patterned insulating layer on the structure layer, the patterned insulating layer having a heater contact opening, wherein the heater contact opening exposing at least part of the heater;    forming a patterned conductive layer overlying the structure layer and filling the heater contact opening to form a signal transmitting circuit;    forming a patterned protective layer overlying the substrate and covering the insulating layer and the conductive layer;    etching at least the protective layer and the insulating layer to form an opening;    forming a fluid channel in the second surface of the substrate, opposing the first surface, and exposing the sacrificial layer;    removing the sacrificial layer to form a fluid chamber; and    etching the structure layer along the opening to form an orifice connecting the fluid chamber.    
   
   
       18 . The method as claimed in  claim 17 , wherein the patterned protective layer further comprises a signal transmitting circuit contact opening, wherein the signal transmitting circuit contact opening exposing at least part of the signal transmitting circuit.  
   
   
       19 . The method as claimed in  claim 18 , wherein the signal transmitting circuit contact opening and the second opening are formed simultaneously.  
   
   
       20 . The method as claimed in  claim 17 , wherein forming the opening includes etching part of the structure layer.  
   
   
       21 . A method for fabricating a monolithic fluid injection device, comprising the steps of: 
 providing a substrate having a first surface and a second surface;    forming a patterned sacrificial layer on the first surface of the substrate;    forming a patterned structure layer on the first surface of the substrate and covering the patterned sacrificial layer;    forming a conductive layer on the structure layer;    forming a patterned resistive layer on the conductive layer as a heater;    patterning the conductive layer to form a signal transmitting circuit;    forming a protective layer overlying the substrate and covering the structure layer, the conductive layer, and the resistive layer;    etching the protective layer to form an opening;    forming a fluid channel in the second surface of the substrate, opposing the first surface, and exposing the sacrificial layer;    removing the sacrificial layer to form a fluid chamber; and    etching the structure layer along the opening to form an orifice connecting the fluid chamber.    
   
   
       22 . The method as claimed in  claim 21 , wherein the patterned protective layer further comprises a signal transmitting circuit contact opening, the signal transmitting circuit contact opening exposing at least part of the signal transmitting circuit.  
   
   
       23 . The method as claimed in  claim 22 , wherein the signal transmitting circuit contact opening and the opening are formed simultaneously.  
   
   
       24 . A method for fabricating a monolithic fluid injection device, comprising the steps of: 
 providing a substrate having a first surface and a second surface;    forming a patterned sacrificial layer on the first surface of the substrate;    forming a patterned structure layer on the first surface of the substrate and covering the patterned sacrificial layer;    forming a conductive layer on the structure layer;    forming a patterned resistive layer on the conductive layer as a heater;    patterning the conductive layer to form a signal transmitting circuit;    forming a protective layer overlying the substrate and covering the structure layer, the conductive layer, and the resistive layer;    forming a fluid channel on a second surface of the substrate, opposing the first surface, and exposing the sacrificial layer;    removing the sacrificial layer to form a fluid chamber; and    etching the protective layer and the structure layer sequentially to form an orifice connecting the fluid chamber.