US2006234159A1PendingUtilityA1

Photosensitive epoxy resin adhesive composition and use thereof

56
Assignee: NITTO DENKO CORPPriority: Apr 19, 2005Filed: Apr 7, 2006Published: Oct 19, 2006
Est. expiryApr 19, 2025(expired)· nominal 20-yr term from priority
Inventors:Miho Yamaguchi
C08G 59/68C08G 59/20C09J 163/00
56
PatentIndex Score
0
Cited by
0
References
0
Claims

Abstract

A photosensitive epoxy resin adhesive composition which is capable of forming a pattern by exposure to light through a photomask and development, and which, even after having formed a pattern in that manner, may still exhibit high adhesiveness when heated while keeping its pattern as such, as well as a photosensitive adhesive film which comprises the photosensitive epoxy resin adhesive composition. The photosensitive epoxy resin adhesive composition comprises an epoxy resin and a photo-acid generator, wherein the epoxy resin comprises a polyfunctional epoxy resin having an epoxy equivalent of from 100 to 300 g/eq and a polyfunctional epoxy resin having an epoxy equivalent of from 450 to 10000 g/eq.

Claims

exact text as granted — not AI-modified
1 . A photosensitive epoxy resin adhesive composition comprising an epoxy resin and an photo-acid generator, wherein the epoxy resin comprises a first polyfunctional epoxy resin having an epoxy equivalent of from 100 to 300 g/eq and a second polyfunctional epoxy resin having an epoxy equivalent of from 450 to 10000 g/eq.  
   
   
       2 . The photosensitive epoxy resin adhesive composition according to  claim 1 , wherein the first polyfunctional epoxy resin has an epoxy equivalent of from 150 to 280 g/eq.  
   
   
       3 . The photosensitive epoxy resin adhesive composition according to  claim 1 , wherein the second polyfunctional epoxy resin has an epoxy equivalent of from 450 to 9,000 g/eq.  
   
   
       4 . The photosensitive epoxy resin adhesive composition according to  claim 1 , wherein the ratio of the first polyfunctional epoxy resin and the second polyfunctional epoxy resin is 5:95 to 90:10 by weight.  
   
   
       5 . The photosensitive epoxy resin adhesive composition according to  claim 4 , wherein the ratio of the first polyfunctional epoxy resin and the second polyfunctional epoxy resin is 10:90 to 60:40 by weight.  
   
   
       6 . The photosensitive epoxy resin adhesive composition according to  claim 5 , wherein the ratio of the first polyfunctional epoxy resin and the second polyfunctional epoxy resin is 10:90 to 50:50 by weight.  
   
   
       7 . A photosensitive adhesive film comprising the photosensitive epoxy resin adhesive composition of  claim 1.

Join the waitlist — get patent alerts

Track US2006234159A1 — get alerts on status changes and closely related new filings.

We store only your email — no account needed. See our privacy policy.