Liquid processing method and liquid processing apparatus
Abstract
In a nozzle unit 4 equipped with processing-liquid nozzles 4 A to 4 J, an air layer 73 and a solvent layer 74 for processing liquid are successively formed outside a processing-liquid layer 71 included in the tip of each nozzle 4 A ( 4 B to 4 J). Next, the solvent layer 74 in the nozzle 4 A is thrown out into a drain part 62 of a standby unit 6 and subsequently, the processing liquid is supplied from the nozzle 4 A to the surface of a wafer W, performing a coating process. After completing the coating process, the processing liquid remaining in the nozzle 4 A is sucked and continuously, respective tips of the nozzles 4 A to 4 J are dipped into respective solvents in solvent reservoir 62 A to 62 J, respectively. From this state, by sucking in the nozzle 4 A, there are newly formed, outside the processing layer 71 in the tip of the nozzle 4 A, an air layer 73 and a solvent layer 74 . Thus, in supplying a substrate, such as semiconductor wafer, with a processing liquid by use of a nozzle unit having a plurality of processing-liquid nozzles integrated, it is possible to prevent dryness of the processing liquids in the respective nozzles while preventing the nozzle unit from being large-sized.
Claims
exact text as granted — not AI-modified1 . A liquid processing method with use of a nozzle unit having a plurality of processing-liquid nozzles arranged integrally and also connected to respective processing-liquid supply passages, for supplying a surface of a substrate with a processing liquid via one of the processing-liquid nozzles, the method comprising the steps of:
forming a processing-liquid layer, an air layer and a solvent layer in each tip of the processing-liquid nozzles of the nozzle unit, in order from the side of the processing-liquid supply passages; subsequently discharging the solvent layer from one of the processing-liquid nozzles of the nozzle unit to a drain part; supplying the surface of the substrate with a processing liquid through the one processing-liquid nozzle; sucking the processing liquid remaining in the one processing-liquid nozzle so as to cause a liquid level of the processing liquid in the one processing-liquid nozzle to retreat toward the processing-liquid supply passages; dipping the tip of at least the one processing-liquid nozzle of the nozzle unit into a solvent in a solvent reservoir for storing the solvent of the processing liquid; and sucking the one processing-liquid nozzle so as to cause the liquid level of the processing liquid in the one processing-liquid nozzle to further retreat toward the processing-liquid supply passages and also cause the solvent in the solvent reservoir to be sucked into the tip of the one processing-liquid nozzle, thereby forming a processing-liquid layer, an air layer and a solvent layer in the tip of the one processing-liquid nozzle, in order from the side of the processing-liquid supply passages.
2 . The liquid processing method as claimed in claim 1 , wherein:
the step of supplying the surface of the substrate with the processing liquid through the one processing-liquid nozzle is done by supplying the processing liquid to the substrate during rotating; the plural processing-liquid nozzles of the nozzle unit are arranged on a straight line passing through a rotational center of the substrate; and the solvent reservoir and the drain part are arranged on a straight line passing through the rotational center of the substrate.
3 . The liquid processing method as claimed in claim 1 , wherein:
the step of dipping the tip of at least the one processing-liquid nozzle of the nozzle unit into the solvent is done by dipping respective tips of the processing-liquid nozzles into respective solvent reservoirs provided for every processing-liquid nozzles, respectively.
4 . The liquid processing method as claimed in claim 1 , wherein:
the step of discharging the solvent layer from the one processing-liquid nozzle is done by moving the processing-liquid nozzles to a common drain part and subsequently discharging the solvent layer from each of the processing-liquid nozzles.
5 . The liquid processing method as claimed in claim 1 , wherein:
the solvent reservoir and the drain part are arranged in a common container adjacently.
6 . A liquid processing method with use of a nozzle unit having a plurality of processing-liquid nozzles arranged integrally and also connected to respective processing-liquid supply passages, for supplying a surface of a substrate with a processing liquid via one of the processing-liquid nozzles, the method comprising:
a first step of forming a processing-liquid layer, an air layer and a solvent layer in each tip of the processing-liquid nozzles of the nozzle unit, in order from the side of the processing-liquid supply passages; and a second step of refilling the solvent layer reduced due to its evaporation after a predetermined time has passed since an execution of the first step; wherein the second step includes the steps of:
discharging the solvent layers from the respective processing-liquid nozzles of the nozzle unit to a drain part;
dipping respective tips of the processing-liquid nozzles of the nozzle unit into a solvent in a solvent reservoir for storing the solvent of the processing liquid; and
sucking the processing-liquid nozzles so as to cause liquid levels of the processing liquids in the processing-liquid nozzles to retreat toward the processing-liquid supply passages and also cause the solvent to be sucked into the tips of the processing-liquid nozzles, thereby forming a processing-liquid layer, an air layer and a solvent layer in the each tip of the processing-liquid nozzles, in order from the side of the processing-liquid supply passages.
7 . The liquid processing method as claimed in claim 6 , wherein:
the step of supplying the surface of the substrate with the processing liquid through the one processing-liquid nozzle is done by supplying the processing liquid to the substrate during rotating; the plural processing-liquid nozzles of the nozzle unit are arranged on a straight line passing through a rotational center of the substrate; and the solvent reservoir and the drain part are arranged on a straight line passing through the rotational center of the substrate.
8 . The liquid processing method as claimed in claim 6 , wherein:
the step of dipping respective tips of the processing-liquid nozzles of the nozzle unit into the solvent for the processing liquid is done by dipping the tips of the processing-liquid nozzles into respective solvent reservoirs provided for every processing-liquid nozzles, respectively.
9 . The liquid processing method as claimed in claim 6 , wherein:
the step of discharging the solvent layers from the processing-liquid nozzles is done by moving the processing-liquid nozzles to a common drain part and subsequently discharging the solvent layers from the processing-liquid nozzles.
10 . The liquid processing method as claimed in claim 6 , wherein:
the solvent reservoir and the drain part are arranged in a common container adjacently.
11 . A liquid processing apparatus comprising:
a substrate holder for holding a substrate horizontally; a nozzle unit in which a plurality of processing-liquid nozzles are provided in a common support integrally, the processing-liquid nozzles being connected to respective processing-liquid supply passages to each supply the substrate held by the substrate holder with a processing liquid; a solvent reservoir for storing a solvent of the processing liquid, the solvent reservoir being arranged so as to allow either part or all of the processing-liquid nozzles of the nozzle unit to dip tips thereof into the solvent; a drain part arranged so as to allow part of the processing-liquid nozzles of the nozzle unit to discharge the processing liquid; suck means for sucking the each processing-liquid nozzles of the nozzle unit; transfer means for transferring the nozzle unit among the solvent reservoir, the drain part and a position to supply the substrate with the processing liquids; and a controller including a program to control the suck means and the transfer means so as to perform the steps as claimed in claim 1 .
12 . The liquid processing apparatus as claimed in claim 11 , adapted so as to perform a liquid processing while supplying the surface of the substrate rotated by the substrate holder with the processing liquid through the single processing-liquid nozzle, wherein:
the plural processing-liquid nozzles of the nozzle unit are arranged on a straight line passing through a rotational center of the substrate; and the solvent reservoir and the drain part are arranged on a straight line passing through the rotational center of the substrate.
13 . The liquid processing apparatus as claimed in claim 11 , wherein:
the nozzle unit further includes a solvent nozzle connected to a solvent supply passage to supply the substrate held by the substrate holder with a solvent for the processing liquid.
14 . The liquid processing apparatus as claimed in claim 13 , wherein:
the plural processing-liquid nozzles and the solvent nozzle are together arranged on a straight line passing through the rotational center of the substrate.
15 . The liquid processing apparatus as claimed in claim 11 , wherein:
the solvent reservoir is provided with respect to each of the processing-liquid nozzles, correspondingly.
16 . The liquid processing apparatus as claimed in claim 11 , wherein:
the solvent reservoir and the drain part are arranged in a common container adjacently.
17 . The liquid processing apparatus as claimed in claim 16 , wherein:
the drain part is provided corresponding to the solvent nozzle.
18 . A liquid processing apparatus comprising:
a substrate holder for holding a substrate horizontally; a nozzle unit in which a plurality of processing-liquid nozzles are provided in a common support integrally, the processing-liquid nozzles being connected to respective processing-liquid supply passages to each supply the substrate held by the substrate holder with a processing liquid; a solvent reservoir for storing a solvent of the processing liquid, the solvent reservoir being arranged so as to allow either part or all of the processing-liquid nozzles of the nozzle unit to dip tips thereof into the solvent; a drain part arranged so as to allow part of the processing-liquid nozzles of the nozzle unit to discharge the processing liquid; suck means for sucking the each processing-liquid nozzles of the nozzle unit; transfer means for transferring the nozzle unit among the solvent reservoir, the drain part and a position to supply the substrate with the processing liquids; and a controller including a program to control the suck means and the transfer means so as to perform the steps as claimed in claim 6 .
19 . The liquid processing apparatus as claimed in claim 18 , adapted so as to perform a liquid processing while supplying the surface of the substrate rotated by the substrate holder with the processing liquid through the single processing-liquid nozzle, wherein:
the plural processing-liquid nozzles of the nozzle unit are arranged on a straight line passing through a rotational center of the substrate; and the solvent reservoir and the drain part are arranged on a straight line passing through the rotational center of the substrate.
20 . The liquid processing apparatus as claimed in claim 18 , wherein:
the nozzle unit further includes a solvent nozzle connected to a solvent supply passage to supply the substrate held by the substrate holder with a solvent for the processing liquid.
21 . The liquid processing apparatus as claimed in claim 20 , wherein:
the plural processing-liquid nozzles and the solvent nozzle are together arranged on a straight line passing through the rotational center of the substrate.
22 . The liquid processing apparatus as claimed in claim 18 , wherein:
the solvent reservoir is provided with respect to each of the processing-liquid nozzles, correspondingly.
23 . The liquid processing apparatus as claimed in claim 18 , wherein:
the solvent reservoir and the drain part are arranged in a common container adjacently.
24 . The liquid processing apparatus as claimed in claim 23 , wherein:
the drain part is provided corresponding to the solvent nozzle.Join the waitlist — get patent alerts
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