Plating solution, conductive material, and surface treatment method of conductive material

Abstract

A plating solution including a copper salt, an organic phosphonic acid compound, and at least one compound or ions selected from an amine, α-amino acid, ammonium ions, carbonic acid ions, carboxylic acid ions, dicarboxylic acid ions, sulfuric acid ions, and thiosulfuric acid ions and a method of treating the surface of a conductive material using this plating solution.

1 . A plating solution including: 
 a copper salt,    an organic phosphonic acid compound, and    at least one compound or ions selected from an amine, α-amino acid, ammonium ions, carbonic acid ions, carboxylic acid ions, dicarboxylic acid ions, sulfuric acid ions, and thiosulfuric acid ions.    
   
   
       2 . The plating solution as set forth in  claim 1 , wherein the content of said compound or ions is, converted to said compound or ions, 0.01 to 2 mol/liter.  
   
   
       3 . The plating solution as set forth in  claim 1 , wherein said plating solution has a pH of 8 to 12 in range.  
   
   
       4 . The plating solution as set forth in  claim 1 , wherein said plating solution further includes at least one type of compound selected from a phosphoric acid compound and hydroxide.  
   
   
       5 . A method of treating the surface of a conductive material comprising using a plating solution as set forth in  claim 1  and an anode containing copper for electrolytic plating to form a protective film comprised of copper on the surface of the conductive material.  
   
   
       6 . The method of treating the surface of a conductive material as set forth in  claim 5  wherein said conductive material is a rare earth magnet.