Exposure method, substrate stage, exposure apparatus, and device manufacturing method

Abstract

In exposing substrate by projecting an image of a pattern onto substrate via projection optical system and liquid, side surface and underside surface of substrate are applied with liquid-repellent treatment. By such a configuration, an exposure method by which when exposing edge areas of the substrate, the exposure can be performed in a condition that a liquid immersion region is formed well and that flowing out of the liquid to the outside of the substrate stage are prevented is provided.

1 . A substrate holding apparatus which contacts an undersurface of a substrate and holds the substrate, at least a portion of a top surface of the substrate being immersed in liquid, said apparatus comprising: 
 a chuck unit to attract the substrate; and    a preventing system to prevent the liquid from reaching the undersurface of the substrate.    
   
   
       2 . An apparatus according to  claim 1 , wherein said preventing system comprises an elastic sealing member arranged so that said elastic sealing member is in contact with the undersurface along a periphery of the undersurface.  
   
   
       3 . An apparatus according to  claim 1 , wherein said preventing system comprises a differential exhaust system to differentially-exhaust a space between the undersurface and said chuck unit along a periphery of the undersurface.  
   
   
       4 . An apparatus according to  claim 1 , wherein said preventing system comprises a liquid-sealant pool arranged along a periphery of the chuck unit.  
   
   
       5 . An apparatus according to  claim 4 , wherein said preventing system comprises a groove defined by said chuck unit, and a supply unit to supply a liquid sealant to said groove.  
   
   
       6 . An apparatus according to  claim 5 , wherein said preventing system comprises an exhaust unit to exhaust the liquid sealant in said groove.  
   
   
       7 . An exposure apparatus, comprising: 
 a projection optical system for projecting a pattern of an original onto a substrate;    a liquid application device for applying liquid to the substrate;    a chuck unit for securing the substrate; and    a liquid prevention device for preventing liquid from contacting an undersurface of the substrate.    
   
   
       8 . A method of manufacturing a device, comprising the steps of: 
 providing a projecting optical system for projecting a pattern of an original onto a substrate;    securing the substrate with a chuck unit;    applying a liquid to the substrate; and    preventing liquid from contacting an undersurface of the substrate.    
   
   
       9 . A substrate holding apparatus for securing an underside of a substrate, with at least a portion of a top surface of the substrate being immersed in liquid, said apparatus comprising: 
 a chuck unit to secure the substrate from the underside; and    liquid sealing means for sealing the underside of the substrate from exposure to the liquid.    
   
   
       10 . A substrate holding apparatus according to  claim 9 , wherein said liquid sealing means includes an elastic sealing member arranged to be in contact along a periphery of the undersurface.  
   
   
       11 . A substrate holding apparatus according to  claim 9 , wherein said liquid sealing means includes an exhaust system to exhaust a space along a periphery of the undersurface.  
   
   
       12 . A substrate holding apparatus according to  claim 11 , wherein said exhaust system includes a plurality of ducts, with each said duct having a different exhaust pressure.  
   
   
       13 . A substrate holding apparatus according to  claim 9 , wherein said liquid sealing means includes a liquid sealant pool arranged around a periphery of said chuck unit.  
   
   
       14 . A substrate holding apparatus according to  claim 13 , wherein said liquid sealant pool includes a liquid sealant supply duct and a liquid sealant exhaust duct.  
   
   
       15 . A substrate holding apparatus according to  claim 9 , wherein said chuck unit is a vacuum chuck.  
   
   
       16 . A substrate holding apparatus according to  claim 9 , wherein said chuck unit is an electrostatic chuck.