Cooling apparatus, system, and associated method

Abstract

The present invention provides a cooling apparatus, system, and associated method. The cooling apparatus includes an insulating material, and a heat transfer device at least partially embedded within the structure material. The cooling apparatus also includes a diamond composite sheet positioned adjacent to the structure material, wherein the diamond composite sheet is in thermal communication with the heat transfer device.

1 . A cooling apparatus comprising: 
 an insulating material;    a heat transfer device at least partially embedded within the structure material; and    a diamond composite sheet positioned adjacent to the structure material, wherein the diamond composite sheet is in thermal communication with the heat transfer device.    
   
   
       2 . The apparatus according to  claim 1 , wherein the structure material comprises an insulating panel.  
   
   
       3 . The apparatus according to  claim 2 , wherein the insulating panel comprises a carbon foam.  
   
   
       4 . The apparatus according to  claim 1 , wherein the heat transfer device comprises a heat pipe.  
   
   
       5 . The apparatus according to  claim 1 , wherein the heat transfer device comprises a liquid cooling tube.  
   
   
       6 . The apparatus according to  claim 1 , wherein the diamond composite sheet is comprised of one of diamond aluminum, diamond silicon, and diamond copper.  
   
   
       7 . The apparatus according to  claim 1 , wherein the diamond composite sheet is positioned adjacent to the heat transfer device.  
   
   
       8 . A cooling apparatus comprising: 
 an insulating material;    a heat transfer device at least partially embedded within the structure material; and    a conductive sheet positioned adjacent to the structure material, wherein the conductive sheet is in thermal communication with the heat transfer device, and wherein heat is capable of conducting three dimensionally within the conductive sheet.    
   
   
       9 . The apparatus according to  claim 8 , wherein the conductive sheet comprises one of a diamond sheet and a diamond composite sheet.  
   
   
       10 . The apparatus according to  claim 9 , wherein the diamond composite sheet comprises of one of diamond aluminum, diamond silicon, and diamond copper.  
   
   
       11 . The apparatus according to  claim 8 , wherein the conductive sheet is positioned adjacent to the heat transfer device.  
   
   
       12 . A cooling system comprising: 
 at least one heat source;    a cooling apparatus thermally coupled to the heat source, the cooling apparatus comprising: 
 a structure material;  
 a heat transfer device at least partially embedded within the structure material; and  
 a diamond composite sheet positioned adjacent to the structure material, wherein the heat transfer device is in thermal communication with the heat source and the diamond composite sheet.  
   
   
   
       13 . The system according to  claim 12 , wherein the diamond composite sheet comprises of one of diamond aluminum, diamond silicon, and diamond copper.  
   
   
       14 . The system according to  claim 12 , wherein the diamond composite sheet is positioned adjacent to the heat transfer device.  
   
   
       15 . The system according to  claim 12 , wherein the heat transfer device is capable of transferring heat from the heat source and to the diamond composite sheet.  
   
   
       16 . A cooling system comprising: 
 at least one heat source;    a cooling apparatus thermally coupled to the heat source, the cooling apparatus comprising: 
 a structure material;  
 a heat transfer device at least partially embedded within the structure material; and  
 a conductive sheet positioned adjacent to the structure material, wherein the heat transfer device is in thermal communication with the heat source and the conductive sheet, and wherein heat is capable of conducting three dimensionally within the conductive sheet.  
   
   
   
       17 . The system according to  claim 16 , wherein the conductive sheet comprises one of a diamond sheet and a diamond composite sheet.  
   
   
       18 . The system according to  claim 17 , wherein the diamond composite sheet comprises one of diamond aluminum, diamond silicon, and diamond copper.  
   
   
       19 . A method for cooling a heat source: 
 positioning a cooling apparatus having a diamond composite sheet supported by a structure material such that the diamond composite sheet is in thermal communication with the heat source; and    transferring heat away from the heat source by movement of the heat through the diamond composite sheet and a heat transfer device embedded within the structure material.    
   
   
       20 . The method according to  claim 19 , wherein positioning comprises attaching the diamond composite sheet to at least one of the structure material and heat transfer device.  
   
   
       21 . The method according to  claim 19 , wherein transferring comprises transferring heat three dimensionally within the diamond composite sheet.  
   
   
       22 . The method according to  claim 19 , wherein transferring comprises transferring heat from the heat source to the diamond composite sheet with the heat transfer device.