Chip washing apparatus

Abstract

A chip washing apparatus comprises an injection tube and a housing, wherein the injection tube includes a water inlet for importing a pressurized washing liquid and a water outlet connected to the housing. A bent bottom edge of the housing is inwardly bent to softly cover the surfaces of the chip and a substrate, which bonds to the chip. After the bent bottom edge of the housing softly covers the surfaces of the chip and the substrate, the pressured washing liquid is allowed to flow through the covered fine slits and gaps between die contacts. Accordingly, the residues between the bonded chip and substrate are removed by the pressured washing liquid.

1 . A chip washing apparatus comprising 
 an injection tube having a water outlet and a water inlet for importing a pressurized washing liquid; and    a housing connected to the water outlet or the water inlet of the injection tube, a bent bottom edge of the housing being bent corresponding to the shape of the chip and a substrate bonded to the chip so as to cover at least a half of fine slits between the chip and the substrate when the bent bottom edge touches the chip, wherein after the pressurized washing liquid is uniformly applied for softly extending a bent tube of the housing and allowing the bent bottom edge to cover the surfaces of the chip and the substrate, the pressured washing liquid is allowed to flow through the covered fine slits and gaps between die contacts.    
   
   
       2 . The chip washing apparatus of  claim 1 , wherein the chip and the substrate can be mounted in a mounting plate with another chip and another substrate, and the injection tubes can jointly ascend or descend and import the pressurized washing liquid such that the bent bottom edge of the housing is allowed to lightly touch and cover the surfaces of the chips and the substrates so as to perform a washing procedure.  
   
   
       3 . The chip washing apparatus of  claim 1 , wherein the chip and the substrate can be mounted in a mounting plate with another chip and another substrate, and the injection tubes can separately ascend or descend and import the pressurized washing liquid such that the bent bottom edge of the housing is allowed to lightly touch and cover the surfaces of the chips and the substrates so as to perform a washing procedure.  
   
   
       4 . The chip washing apparatus of  claim 1 , wherein after the pressurized washing liquid washes the fine slits on one side of the chip for a predetermined time period, the housing is raised to separate the bent bottom edge from the surfaces of the chip and the substrate, and thereafter the uncovered fine slits between the chip and the substrate and parts of the covered fine slits in the previous washing process are covered by the bent bottom edge of the housing to expose little parts of the covered fine slits such that the pressurized washing liquid can wash the chip in a reverse direction.  
   
   
       5 . The chip washing apparatus of  claim 1 , wherein another housing is further applied to individually cover the chip in a different direction so as to allow the pressurized washing liquid to flow through and wash the fine slits between the chip and the substrate in a different direction.  
   
   
       6 . The chip washing apparatus of  claim 1 , wherein the bent bottom edge of the housing between the covered fine slits and the uncovered fine slits is slanted toward the uncovered fine slits.  
   
   
       7 . The chip washing apparatus of  claim 1 , wherein a suction tube is mounted beside the uncovered fine slits of the chip.  
   
   
       8 . The chip washing apparatus of  claim 1 , wherein the housing and another housing are coupled to one another to symmetrically cover the surfaces of the chip and the substrate and each of them comprises control valves for connecting to the pressurized washing liquid and a suction apparatus.  
   
   
       9 . The chip washing apparatus of  claim 1 , wherein the bent bottom edge of the housing is bent inwardly or outwardly.  
   
   
       10 . The chip washing apparatus of  claim 1 , wherein the chip bonded to the surface of the substrate is immersed in the washing liquid with a liquid level over the chip, and an external pumping apparatus is connected to the injection tube for allowing the pressurized washing liquid to uniformly flow through the covered fine slits between the bonded chip and substrate.