Sockets for "springed" semiconductor devices

Abstract

Temporary connections to spring contact elements extending from an electronic component such as a semiconductor device are made by urging the electronic component, consequently the ends of the spring contact elements, vertically against terminals of an interconnection substrate, or by horizontally urging terminals of an interconnection substrate against end portions of the spring contact elements. A variety of terminal configurations are disclosed.

1 - 8 . (canceled)  
   
   
       9 . An interconnection substrate for receiving an elongate spring contact element, the interconnection substrate comprising: 
 an interconnection substrate with a terminal which is a plated through hole, the hole designed to receive a corresponding elongate spring contact element and form an electrical connection therewith.    
   
   
       10 . The interconnection substrate of  claim 9  further comprising an electronic component electrically connected to the interconnection substrate, the electronic component in turn comprising an elongate spring contact element extending away from the electronic component and mating with the terminal of the interconnection substrate to form an electrical connection.  
   
   
       11 . The interconnection substrate of  claim 9  further comprising a plurality of terminals formed therein, selected ones of which are plated through holes designed to receive corresponding elongate spring contact elements.  
   
   
       12 . The interconnection substrate of  claim 11  further comprising an electronic component electrically connected to the interconnection substrate, the electronic component in turn comprising a plurality of elongate spring contact elements, selected ones of which extend away from the electronic component and mate with corresponding selected ones of the terminals of the interconnection substrate.  
   
   
       13 - 17 . (canceled)