Coating composition for dielectric insulating film, dielectric insulating film prepared therefrom, and electric or electronic device comprising the same

Abstract

The present invention relates to a coating composition for a dielectric insulating film comprising a) an organosiloxane polymer, b) first metal ions selected from the group consisting of Rb ions, Cs ions, and a mixture thereof, and c) an organic solvent, in which the first metal ions are comprised at 1 to 200 ppm based on the weight of the composition, a dielectric insulating film prepared therefrom, and an electric or electronic device comprising the same. A dielectric insulating film prepared from the coating composition of the present invention has an improved dielectric constant and superior mechanical strength and electric properties.

1 . A coating composition for a dielectric insulating film, comprising: 
 a) an organosiloxane polymer;    b) first metal ions selected from the group consisting of Rb ions, Cs ions, and a mixture thereof; and    c) an organic solvent,    wherein the first metal ions are comprised at 1 to 200 ppm based on the weight of the composition.    
     
     
         2 . The coating composition of  claim 1 , wherein the organosiloxane polymer is polymerized from at least one silane compound selected from the group consisting of: 
 a) at least one monomer selected from the group consisting of the compounds represented by Formula 1 and Formula 2 below;    b) a dimer prepared from the monomer; and    c) an oligomer prepared from the monomer, the dimer, or a mixture thereof,      SiR 1   p R 2   4-p    (1)    where    R 1  is hydrogen, an aryl, a vinyl, an allyl, a C 1 -C 4  linear or branched alkyl substituted with fluorine, or a C 1 -C 4  linear or branched alkyl not substituted with fluorine,    R 2  is a linear or branched C 1 -C 4  alkoxy, acetoxy, or chlorine, and    p is an integer 1, or 2, and      R 3   q R 4   3-q Si-M-SiR 5   r R 6   3-r ,   (2)    where    each of R 3  and R 5  is, independently, hydrogen, a fluorine, an aryl, a vinyl, an allyl, a C 1 -C 4  linear or branched alkyl substituted with fluorine, or a C 1 -C 4  linear or branched alkyl not substituted with fluorine, each of R 4  and R 6  is, independently, a C 1 -C 4  linear or branched alkoxy, acetoxy, or chlorine;    M is a C 1 -C 6  alkylene, or a phenylene; and    each of q and r is an integer of 0 to 2.    
     
     
         3 . The coating composition of  claim 1 , wherein the total content of the second metal ions which are metal ions excluding the Rb ions or the Cs ion is 0.5 ppm or smaller.  
     
     
         4 . The coating composition of  claim 3 , wherein the total content of Na ions and K ions is 0.1 ppm or smaller.  
     
     
         5 . The coating composition of  claim 1 , wherein the organic solvent is at least one selected from the group consisting of: 
 a) at least one aliphatic hydrocarbon solvent selected from the group consisting of n-pentane, i-pentane, n-hexane, i-hexane, 2,2,4-trimethylpentane, cyclohexane, and methylcyclohexane;    b) at least one aromatic hydrocarbon solvent selected from the group consisting of benzene, toluene, xylene, trimethylbenzene, ethylbenzene, and methyl ethylbenzene;    c) at least one alcohol solvent selected from the group consisting of methyl alcohol, ethyl alcohol, n-propanol, i-propanol, n-butanol, i-butanol, sec-butanol, t-butanol, 4-methyl 2-pentanol, cyclohexanol, methylcyclohexanol, and glycerol;    d) at least one ketone solvent selected from the group consisting of methyl ethyl ketone, methyl isobutyl ketone, diethyl ketone, methyl n-propyl ketone, methyl n-butyl ketone, cyclohexanone, methylcyclohexanone, and acetylacetone;    e) at least one ether solvent selected from the group consisting of tetrahydrofuran, 2-methyltetrahydrofuran, ethyl ether, n-propyl ether, isopropyl ether, diglyme, dioxin, dimethyldioxin, ethylene glycol monomethyl ether, ethylene glycol dimethyl ether, ethylene glycol diethyl ether, propylene glycol monomethyl ether, and propylene glycol dimethyl ether;    f) at least one ester solvent selected from the group consisting of diethyl carbonate, methyl acetate, ethyl acetate, ethyl lactate, ethylene glycol monomethyl ether acetate, propylene glycol monomethyl ether acetate, and ethylene glycol diacetate; and    g) at least one amide solvent selected from the group consisting of N-methylpyrrolidone, formamide, N-methylformamide, N-ethylformamide, N,N-dimethylacetamide, and N,N-diethylacetamide.    
     
     
         6 . The coating composition of  claim 1 , further comprising: 
 d) a pore generating material.    
     
     
         7 . The coating composition of  claim 6 , wherein the pore generating material is at least one organic molecule selected from the group consisting of an aliphatic hydrocarbon, an aromatic hydrocarbon, an ether compound, an ester compound, an anhydride compound, a carbonate compound, an acryl compound, a thioether compound, an isocyanate compound, an isocyanurate compound, a sulfone compound, and a sulfoxide compound that can be pyrolyzed in the temperature range of 150 to 450° C., and a polymer polymerized therefrom.  
     
     
         8 . The coating composition of  claim 7 , wherein the pore generating material is a linear polymer, a block copolymer, a radial polymer, or a crosslinkage polymer which has a weight-average molecular weight of 300 to 100,000.  
     
     
         9 . The coating composition of  claim 1 , wherein a solid content of the coating composition is 2 to 60 wt %.  
     
     
         10 . The coating composition of  claim 1 , further comprising: 
 e) water.    
     
     
         11 . A dielectric insulating film prepared from a coating composition of  claim 1  and comprising 5 to 1500 ppm of the first metal ions selected from the group consisting of Rb ions, Cs ions, and a mixture thereof, based on the weight of the dielectric insulating film.  
     
     
         12 . The dielectric insulating film of  claim 11 , wherein the coating composition comprises a organosiloxane polymer which is polymerized from at least one silane compound selected from the group consisting of: 
 a) at least one monomer selected from the group consisting of the compounds represented by Formula 1 and Formula 2 below;    b) a dimer prepared from the monomer; and    c) an oligomer prepared from the monomer, the dimer, or a mixture thereof,      SiR 1   p R 2   4-p    (1)    where    R 1  is hydrogen, an aryl, a vinyl, an allyl, a C 1 -C 4  linear or branched alkyl substituted with fluorine, or a C 1 -C 4  linear or branched alkyl not substituted with fluorine,    R 2  is a linear or branched C 1 -C 4  alkoxy, acetoxy, or chlorine, and p is an integer 1, or 2, and    R 3   q R 4   3-q Si-M-SiR 5   r R 6   3-r ,   (2)        where    each of R 3  and R 5  is, independently, hydrogen, a fluorine, an aryl, a vinyl, an allyl, a C 1 -C 4  linear or branched alkyl substituted with fluorine, or a C 1 -C 4  linear or branched alkyl not substituted with fluorine, each of R 4  and R 6  is, independently, a C 1 -C 4  linear or branched alkoxy, acetoxy, or chlorine;    M is a C 1 -C 6  alkylene, or a phenylene; and    each of q and r is an integer of 0 to 2.    
     
     
         13 . The dielectric insulating film of  claim 11 , wherein a total content of second metal ions which are metal ions excluding the Rb ions or the Cs ion in the coating composition is 0.5 ppm or smaller.  
     
     
         14 . The dielectric insulating film of  claim 11 , wherein the coating composition comprises at least one organic solvent selected from the group consisting of: 
 a) at least one aliphatic hydrocarbon solvent selected from the group consisting of n-pentane, i-pentane, n-hexane, i-hexane, 2,2,4-trimethylpentane, cyclohexane, and methylcyclohexane;    b) at least one aromatic hydrocarbon solvent selected from the group consisting of benzene, toluene, xylene, trimethylbenzene, ethylbenzene, and methyl ethylbenzene;    c) at least one alcohol solvent selected from the group consisting of methyl alcohol, ethyl alcohol, n-propanol, i-propanol, n-butanol, i-butanol, sec-butanol, t-butanol, 4-methyl 2-pentanol, cyclohexanol, methylcyclohexanol, and glycerol;    d) at least one ketone solvent selected from the group consisting of methyl ethyl ketone, methyl isobutyl ketone, diethyl ketone, methyl n-propyl ketone, methyl n-butyl ketone, cyclohexanone, methylcyclohexanone, and acetylacetone;    e) at least one ether solvent selected from the group consisting of tetrahydrofuran, 2-methyltetrahydrofuran, ethyl ether, n-propyl ether, isopropyl ether, diglyme, dioxin, dimethyldioxin, ethylene glycol monomethyl ether, ethylene glycol dimethyl ether, ethylene glycol diethyl ether, propylene glycol monomethyl ether, and propylene glycol dimethyl ether;    f) at least one ester solvent selected from the group consisting of diethyl carbonate, methyl acetate, ethyl acetate, ethyl lactate, ethylene glycol monomethyl ether acetate, propylene glycol monomethyl ether acetate, and ethylene glycol diacetate; and    g) at least one amide solvent selected from the group consisting of N-methylpyrrolidone, formamide, N-methylformamide, N-ethylformamide, N,N-dimethylacetamide, and N,N-diethylacetamide.    
     
     
         15 . The dielectric insulating film of  claim 11 , wherein the coating composition further comprises d) a pore generating material.  
     
     
         16 . The dielectric insulating film of  claim 15 , wherein the pore generating material is at least one organic molecule selected from the group consisting of an aliphatic hydrocarbon, an aromatic hydrocarbon, an ether compound, an ester compound, an anhydride compound, a carbonate compound, an acryl compound, a thioether compound, an isocyanate compound, an isocyanurate compound, a sulfone compound, and a sulfoxide compound that can be pyrolyzed in the temperature range of 150 to 450° C., and a polymer polymerized therefrom.  
     
     
         17 . The dielectric insulating film of  claim 16 , wherein the pore generating material is a linear polymer, a block copolymer, a radial polymer, or a crosslinkage polymer which has a weight-average molecular weight of 300 to 100,000.  
     
     
         18 . The dielectric insulating film of  claim 11 , wherein a solid content of the coating composition is 2 to 60 wt %.  
     
     
         19 . The dielectric insulating film of  claim 11 , wherein the coating composition further comprises e) water.  
     
     
         20 . An electric or electronic device comprising the dielectric insulating film of  claim 11.