Substrate treating apparatus and substrate treating method

Abstract

In a substrate treating unit, a removal liquid supplying mechanism supplies a removal liquid to the surface of a substrate. In order to retain the removal liquid on the surface of the substrate for a fixed time, a spin chuck is operated to spin the substrate at such a low speed as to retain the removal liquid on the substrate, or spins the substrate intermittently, or temporarily stops spinning of the substrate. Thus, treatment with the removal liquid progresses without a further supply of the removal liquid, thereby restraining consumption of the removal liquid.

1 - 18 . (canceled)  
   
   
       19 . A substrate treating apparatus for removing an organic substance from a substrate by using a removal liquid, said apparatus comprising: 
 a spin chuck for supporting and spinning the substrate; and    a removal liquid supplying mechanism for supplying the removal liquid to a surface of the substrate supported by the spin chuck;    wherein said spin chuck is operable, after the removal liquid supplying mechanism supplies the removal liquid to the surface of the substrate, in one of modes for spinning the substrate at such a low speed as to retain the removal liquid on the substrate, for spinning the substrate intermittently, and for temporarily stopping spinning of the substrate.    
   
   
       20 . A substrate treating apparatus as defined in  claim 19 , wherein said removal liquid supplying mechanism is operable for supplying the removal liquid to the surface of the substance while said spin chuck spins the substrate at a first speed, and thereafter supplying the removal liquid to the surface of the substrate while said spin chuck spins the substrate at a second speed lower than the first speed.  
   
   
       21 . A substrate treating apparatus as defined in  claim 19 , further comprising: 
 a cup for capturing the removal liquid scattering from the substrate supported and spun by said spin chuck;    exhaust means for exhausting gas from said cup; and    control means for reducing gas exhaustion from said cup when the removal liquid is supplied to the surface of the substrate to remove a reaction product therefrom.    
   
   
       22 . A substrate treating apparatus as defined in  claim 21 , further comprising; 
 a deionized water supplying mechanism for supplying deionized water to the substrate supported by said spin chuck; and    a discharge line for draining the deionized water supplied by said deionized water supplying mechanism to the substrate, and draining the deionized water captured by said cup;    said exhaust means exhausting gas from said cup through said discharge line.    
   
   
       23 . A substrate treating apparatus as defined in  claim 19 , wherein said organic substance is a reaction product resulting from a dry etching with a resist film used as a mask.  
   
   
       24 . A substrate treating apparatus as defined in  claim 19 , wherein said organic substance is a polymer.  
   
   
       25 . A substrate treating apparatus as defined in  claim 19 , wherein said organic substance is a reaction product resulting from a change in property of resist.