Radio frequency identification (RFID) tag lamination process

Abstract

A method of constructing an RFID unit can include using a protective layer to hold an integrated circuit chip module to a substrate layer with an antenna unit while a conductive adhesive has not yet fully set.

1 . A method of constructing an RFID unit comprising: 
 attaching an integrated circuit chip to a substrate with an antenna unit using an adhesive; and    laminating a protective layer over at least part of the integrated circuit chip while the adhesive has not yet fully set.    
     
     
         2 . The method of  claim 1 , wherein the integrated circuit chip is part of a chip module.  
     
     
         3 . The method of  claim 2 , wherein the chip module includes a lead frame.  
     
     
         4 . The method of  claim 2 , wherein attaching step comprises using the adhesive to connect a connection element of the module to the substrate.  
     
     
         5 . The method of  claim 1 , wherein any dwell time between the attaching and laminating steps is less than less than minute.  
     
     
         6 . The method of  claim 1 , wherein the attachment step is done at a rate of one attachment per second or greater.  
     
     
         7 . The method of  claim 1 , wherein the adhesive takes over a day to fully set.  
     
     
         8 . The method of  claim 1 , wherein the adhesive is an electrically conductive adhesive.  
     
     
         9 . The method of  claim 8 , wherein the conductive adhesive is solder paste.  
     
     
         10 . The method of  claim 1 , wherein the integrated circuit chip is attached to the protective layer before the attaching step.  
     
     
         11 . The method of  claim 1 , wherein the protective layer is stretchy to conform to IC chip.  
     
     
         12 . An apparatus to construct an RFID unit comprising: 
 a unit to attach an integrated circuit chip to a substrate with an antenna unit using an adhesive; and    a unit to laminate a protective layer over at least part of the integrated circuit chip while the adhesive has not yet fully set.    
     
     
         13 . The apparatus of  claim 12 , wherein the integrated circuit chip is part of a chip module.  
     
     
         14 . The apparatus of  claim 12 , wherein the laminating unit connects a strip of the protective layer to a strip of the substrate.  
     
     
         15 . The apparatus of  claim 12 , wherein the laminating unit uses hot rollers.  
     
     
         16 . The apparatus of  claim 12 , wherein the attaching unit operates at a rate of one attachment per second or greater.  
     
     
         17 . The apparatus of  claim 12 , wherein the integrated circuit chip is attached to the protective layer before the attaching unit.  
     
     
         18 . A method of constructing an flexible circuit comprising: 
 attaching an integrated circuit chip to a substrate with an circuit traces using an adhesive; and;    laminating a protective layer over at least part of the integrated circuit chip while the adhesive has not yet fully set.