Textile information carrier and method for producing a textile information carrier

Abstract

A textile information carrier is described, consisting of a textile label or textile goods and a textile detection wafer having a textile carrier, which is joined to the textile label or the textile goods. A textile antenna and an electronic chip module connected to the textile antenna are disposed in or on the textile carrier.

1 . A textile information carrier, consisting of a textile label or textile goods and a textile detection wafer joined to the textile label or the textile goods, comprising a textile carrier in or on which are disposed a textile antenna and an electronic chip module connected to the textile antenna.  
   
   
       2 . The textile information carrier according to  claim 1 , wherein the textile detection wafer is joined with its inner side bearing the electronic chip module reversibly detachably or irreversibly undetachably to the textile label or the textile goods.  
   
   
       3 . The textile information carrier according to  claim 1 , wherein the textile detection wafer is joined to the textile label or the textile goods by welding or bonding or coating or laminating or adhesion or by means of an adhesive film or by means of a patch joint produced under heat and pressure.  
   
   
       4 . The textile information carrier according to  claim 3 , wherein the connection consists of discrete connection points or very fine perforated adhesive film.  
   
   
       5 . The textile information carrier according to  claim 3 , wherein the connection consists of self-adhesive embroidery yarn which is embroidered onto the textile carrier of the textile detection wafer.  
   
   
       6 . The textile information carrier according to  claim 1 , wherein the textile detection wafer is joined to the textile label or the textile goods by a sewing or embroidery connection.  
   
   
       7 . The textile information carrier according to  claim 1 , wherein the antenna is woven-in in a common textile manufacturing process of the textile carrier.  
   
   
       8 . The textile information carrier according to  claim 1 , wherein the antenna is embroidered in a separate textile manufacturing process on the textile carrier.  
   
   
       9 . The textile information carrier according to  claim 3 , wherein the textile carrier is joined to the adhesive film before the embroidery process.  
   
   
       10 . The textile information carrier according to  claim 7 , wherein the woven antenna consists of a hybrid yarn comprising at least one synthetic and/or natural fibre or of synthetic and/or natural multifibres or of at least one synthetic and/or natural filament or of synthetic and/or natural multifilaments and of at least one electrically conductive filament.  
   
   
       11 . The textile information carrier according to  claim 8 , wherein the embroidered antenna comprises an upper thread and a lower thread of which one of the threads consists of a hybrid yarn comprising at least one synthetic and/or natural fibre or of synthetic and/or natural multifibres or of at least one synthetic and/or natural filament or of synthetic and/or natural multifilaments and of at least one electrically conductive filament, and the other thread consists of a yarn comprising at least one synthetic and/or natural fibre or of synthetic and/or natural multifibres or of at least one synthetic and/or natural filament or of synthetic and/or natural multifilaments.  
   
   
       12 . The textile information carrier according to  claim 10 , wherein the at least one synthetic and/or natural fibre or of synthetic and/or natural multifibres or the at least one synthetic and/or natural filament or the synthetic and/or natural multifilaments is twisted or intermingled/textured and then twisted with the at least one electrically conductive filament.  
   
   
       13 . The textile information carrier according to  claim 10 , wherein the synthetic fibres or synthetic multifibres or synthetic filaments or synthetic multifilaments form a polyamide or polyester texture yarn.  
   
   
       14 . The textile information carrier according to  claim 10 , wherein the electrically conductive filaments are copper or brass or aluminium monofilaments or multifilaments.  
   
   
       15 . The textile information carrier according to  claim 10 , wherein the electrically conductive filaments are polyamide or polyester monofilaments or multifilaments with vapour-coated or electrolytically coated metal surfaces.  
   
   
       16 . The textile information carrier according to  claim 10 , wherein the electrically conductive filaments are carbon yarns.  
   
   
       17 . The textile information carrier according to  claim 10 , wherein the electrically conductive filaments are cut aluminium or aluminium-plastic composite films.  
   
   
       18 . The textile information carrier according to  claim 10 , wherein the electrically conductive filaments are metal cut fibres disposed in the spun yarn.  
   
   
       19 . The textile information carrier according  claim 1 , wherein the antenna is constructed as a half-wave dipole.  
   
   
       20 . The textile information carrier according  claim 1 , wherein the antenna is constructed as a shortened dipole with extension coils.  
   
   
       21 . The textile information carrier according to  claim 1 , wherein the antenna is constructed as a quarter-wave ground plane comprising an emitter and a counterpoise.  
   
   
       22 . The textile information carrier according to  claim 1 , wherein the antenna is constructed as an electrically shortened ground plane comprising a shortened emitter with an extension coil and a counterpoise.  
   
   
       23 . The textile information carrier according to  claim 1 , wherein the antenna is constructed as a magnetic loop.  
   
   
       24 . The textile information carrier according to  claim 1 , wherein connections of the antenna are joined to connections of the chip module by an adhesive join comprising an electrically conductive, oven- or UV-curable adhesive paste.  
   
   
       25 . The textile information carrier according to  claim 1 , wherein connections of the antenna are joined to connections of the chip module by an adhesive join comprising an electrically conductive hot-melt adhesive which is applied warm and in liquid form, which melts under heating and is cured at ambient temperature.  
   
   
       26 . The textile information carrier according to  claim 1 , wherein connections of the antenna are joined to connections of the chip module by an adhesive join comprising an electrically conductive hot-melt adhesive provided on the textile carrier or connections of the chip module, which is activated by temporary heating and then cured at ambient temperature.  
   
   
       27 . The textile information carrier according to  claim 1 , wherein connections of the antenna are joined to connections of the chip module by an adhesive join comprising an electrically conductive adhesive foil or an electrically conductive adhesive foil, wherein the adhesive film or adhesive foil are disposed in the connections of the chip module and is activated by pressure and heat during the adhesion process.  
   
   
       28 . The textile information carrier according to  claim 1 , wherein connections of the antenna are joined to connections of the chip module by a welded join.  
   
   
       29 . The textile information carrier according to  claim 1 , wherein connections of the antenna are joined to connections of the chip module by a crimp joint.  
   
   
       30 . The textile information carrier according to  claim 1 , wherein the chip module is fixed on the textile carrier by embroidery yarn.  
   
   
       31 . The textile information carrier according to  claim 30 , wherein the embroidery yarn wraps around soldering tags of the chip module.  
   
   
       32 . The textile information carrier according to  claim 30 , wherein the embroidery yarn penetrates into holes in soldering tags of the chip module.  
   
   
       33 . The textile information carrier according to  claim 1 , wherein the chip module and the connections of the chip module with the antenna are potted as a globtop using a protective compound.  
   
   
       34 . The textile information carrier according to  claim 1 , wherein the textile detection wafer has constant dimensions for different sizes of textile label or textile goods, which are determined according to the smallest technically still-feasible size of the textile detection wafer.  
   
   
       35 . The textile information carrier according to  claim 1 , wherein the textile detection wafer has uniform electrical and electronic properties for different sizes of textile label or textile goods.  
   
   
       36 . The textile information carrier according to  claim 1 , wherein the textile detection wafer has the same reading range for different sizes of textile label or textile goods.  
   
   
       37 . A method for manufacturing a textile information carrier having the features according to  claim 1 , wherein a textile label or textile goods on the one hand and a textile detection wafer comprising a textile carrier in or on which are disposed a textile antenna and an electronic chip module connected to the textile antenna on the other hand, are first manufactured separately and then joined together.  
   
   
       38 . The method according to  claim 37 , wherein the textile detection wafer is made from a textile carrier, an antenna is embroidered on the textile carrier, a chip module with its connections is then positioned over connections of the antenna and the connections of the chip module are then connected in an electrically conducting fashion to the connections of the antenna.  
   
   
       39 . The method according to  claim 37 , wherein the textile detection wafer is made from a textile carrier, an antenna is embroidered on the textile carrier, and a chip module is positioned over connections of the antenna and fixed by means of embroidery yarn and at the same time as the fixing or subsequently, the connections of the chip module are connected in an electrically conducting fashion to the connections of the antenna.  
   
   
       40 . The method according to  claim 37 , wherein textile labels or textile goods of different size are connected to textile detection wafers of constant dimensions, wherein the dimensions are determined according to the smallest technically still feasible size of the textile detection wafer.