Method and system for providing a power lateral PNP transistor using a buried power buss

Abstract

A power lateral PNP device is disclosed which includes an epitaxial layer; a first and second collector region embedded in the epitaxial layer; an emitter region between the first and second collector regions. Therefore slots are placed in each of the regions. Accordingly, in a first approach the standard process flow will be followed until reaching the point where contact openings and metal are to be processed. In this approach slots are etched that are preferably 5 to 6 um deep and 5 to 6 um wide. These slots are then oxidized and will be subsequently metalized. When used for making metal contacts to the buried layer or for ground the oxide is removed from the bottom of the slots by an anisotropic etch. Subsequently when these slots receive metal they will provide contacts to the buried layer where this is desired and to the substrate when a ground is desired. In a second approach the above-identified process is completed up through the slot process without processing the lateral PNPs. With a separate masking and etching the oxide is removed from the PNP slots and boron is deposited in a diffusion furnace and driven in a non oxidizing atmosphere.

1 . A system for providing a lateral PNP device comprising: 
 means for growing an epitaxial layer;    means for providing first and second regions, the first and second regions becoming first and second collectors after a diffusion;    means for providing a third region between the first and second regions, the third region becoming an emitter region after the diffusion;    means for etching slots in each of the emitter and first and second collectors;    means for doping each of the slots with boron; and    means for filling each of the doped slots with metal.    
   
   
       2 . The system of  claim 1  wherein the slot in the emitter region provides for separate emitter structures.  
   
   
       3 . The system of  claim 1  wherein the metal filling means is performed by CVD metal deposition.  
   
   
       4 . The system of  claim 1  wherein the metal filling means is performed by applying the metal in layers and planarizing the metal.  
   
   
       5 . The system of  claim 1  wherein the slot in the emitter region is not oxidized at the bottom.