Test sockets, test systems, and methods for testing microfeature devices

Abstract

Test sockets, test systems, and methods for testing microfeature devices with a substrate and a plurality of conductive interconnect elements projecting from the substrate. In one embodiment, a test socket includes a support surface and a plurality of apertures in the support surface corresponding to at least some of the interconnect elements of the microfeature device. The individual apertures extend through the test socket and are sized to receive a portion of one of the interconnect elements so that the substrate is spaced apart from the support surface when the microfeature device is received in the test socket. In one aspect of this embodiment, the individual apertures have a cross-sectional dimension less than a cross-sectional dimension of the interconnect elements so that the apertures receive only a portion of the corresponding interconnect element.

1 - 51 . (canceled)  
   
   
       52 . A method of manufacturing a test socket for receiving a microfeature device having a substrate and a plurality of interconnect elements projecting from the substrate, the method comprising: 
 providing a test socket body including a recess and a shelf in the recess; and    placing a support member in the recess so that the support member is carried by the shelf, the support member having a plurality of apertures positioned to receive corresponding interconnect elements of the microfeature device, the individual apertures being sized to receive a portion of the corresponding interconnect elements so that the substrate is spaced apart from the support member when the microfeature device is received in the recess.    
   
   
       53 . The method of  claim 52 , further comprising constructing the support member by forming the plurality of apertures in rows and columns corresponding to an array of interconnect elements on the microfeature device.  
   
   
       54 . The method of  claim 52 , further comprising constructing the support member by forming an opening in the support member and the apertures around a perimeter of the opening.  
   
   
       55 . The method of  claim 52 , further comprising constructing the support member by forming the apertures such that the individual apertures have a cross-sectional dimension less than a cross-sectional dimension of the corresponding interconnect elements.  
   
   
       56 . The method of  claim 52 , further comprising constructing the support member by forming the apertures such that the individual apertures have a first portion with a first diameter and a second portion with a second diameter greater than the first diameter.  
   
   
       57 . The method of  claim 52 , further comprising constructing the support member by forming the apertures such that the individual apertures have a beveled portion.  
   
   
       58 . A method of manufacturing a test socket for receiving a microfeature device having a substrate and a plurality of conductive balls on the substrate, the method comprising forming a test socket including a support surface and a plurality of apertures in the support surface corresponding to at least some of the conductive balls of the microfeature device, the individual apertures being sized to receive a portion of the corresponding conductive ball so that the substrate is spaced apart from the support surface when the microfeature device is received in the test socket.  
   
   
       59 . The method of  claim 58  wherein forming the test socket comprises: 
 forming a ball support member having the support surface and the apertures in the support surface; and    placing the ball support member in a recess of the test socket.    
   
   
       60 . The method of  claim 58  wherein forming the test socket comprises forming the apertures in the support surface in rows and columns corresponding to an array of conductive balls on the microfeature device.  
   
   
       61 . The method of  claim 58  wherein forming the test socket comprises forming an opening in the support surface and the apertures around a perimeter of the opening.  
   
   
       62 . The method of  claim 58  wherein forming the test socket comprises forming the apertures in the support surface such that the individual apertures have a diameter less than a diameter of the corresponding conductive ball.  
   
   
       63 . The method of  claim 58  wherein forming the test socket comprises forming the apertures in the support surface such that the individual apertures have a first portion with a first diameter and a second portion with a second diameter greater than the first diameter.