Test sockets, test systems, and methods for testing microfeature devices

Abstract

Test sockets, test systems, and methods for testing microfeature devices with a substrate and a plurality of conductive interconnect elements projecting from the substrate. In one embodiment, a test socket includes a support surface and a plurality of apertures in the support surface corresponding to at least some of the interconnect elements of the microfeature device. The individual apertures extend through the test socket and are sized to receive a portion of one of the interconnect elements so that the substrate is spaced apart from the support surface when the microfeature device is received in the test socket. In one aspect of this embodiment, the individual apertures have a cross-sectional dimension less than a cross-sectional dimension of the interconnect elements so that the apertures receive only a portion of the corresponding interconnect element.

1 - 38 . (canceled)  
   
   
       39 . A method of testing a microfeature device having a substrate and a plurality of interconnect elements projecting from the substrate, the method comprising: 
 providing a test socket including a support surface and a plurality of apertures in the support surface;    placing the microfeature device in the test socket such that several interconnect elements are received partially within corresponding apertures to provide a gap between the substrate and the support surface; and    inserting test contacts into the corresponding apertures to contact the interconnect elements received in the apertures.    
   
   
       40 . The method of  claim 39  wherein placing the microfeature device in the test socket comprises aligning the interconnect elements on the microfeature device with corresponding test contacts.  
   
   
       41 . The method of  claim 39  wherein placing the microfeature device in the test socket comprises spacing the substrate apart from the support surface so that debris on the support surface does not contact the substrate.  
   
   
       42 . The method of  claim 39  wherein: 
 the substrate further includes a first surface, a second surface opposite the first surface, and a plurality of ends connecting the first and second surfaces; and    placing the microfeature device in the test socket comprises aligning the interconnect elements on the microfeature device with corresponding test contacts without reference to the ends of the substrate.    
   
   
       43 . The method of  claim 39  wherein: 
 the test socket has an opening in the support surface about which the apertures are arranged; and    placing the microfeature device in the test socket comprises placing the microfeature device in the test socket with some of the interconnect elements received partially within corresponding apertures and other interconnect elements at the opening.    
   
   
       44 . The method of  claim 39  wherein: 
 the apertures in the support surface are arranged in rows and columns corresponding to an array of interconnect elements on the microfeature device; and    placing the microfeature device in the test socket comprises placing the microfeature device in the test socket with the array of interconnect elements received partially within corresponding apertures.    
   
   
       45 . The method of  claim 39  wherein placing the microfeature device in the test socket comprises placing the microfeature device in the test socket with several of the interconnect elements having a greater cross-sectional dimension than a cross-sectional dimension of the corresponding apertures.  
   
   
       46 . The method of  claim 39  wherein providing the test socket comprises: 
 providing a test socket body having a recess and a shelf in the recess; and    placing a support member having the support surface and the apertures in the recess so that the support member is carried by the shelf.    
   
   
       47 . A method of testing a microfeature device having a substrate and a plurality of conductive balls on the substrate, the method comprising: 
 positioning at least some of the conductive balls of the microfeature device partially within corresponding apertures in a support surface of a test socket so that the substrate is spaced apart from the support surface; and    contacting the conductive balls with corresponding test contacts to test the microfeature device while the microfeature device is received within the test socket.    
   
   
       48 . The method of  claim 47  wherein positioning at least some of the conductive balls comprises aligning the conductive balls on the microfeature device with corresponding test contacts.  
   
   
       49 . The method of  claim 47  wherein positioning at least some of the conductive balls comprises providing a gap between the substrate and the support surface so that debris on the support surface does not contact the substrate.  
   
   
       50 . The method of  claim 47  wherein: 
 the support surface further includes an opening;    the apertures are arranged around the opening; and    positioning at least some of the conductive balls comprises positioning some of the conductive balls partially within corresponding apertures and other conductive balls at the opening.    
   
   
       51 . The method of  claim 47  wherein: 
 the apertures in the support surface are arranged in rows and columns corresponding to an array of conductive balls on the microfeature device; and    positioning at least some of the conductive balls comprises positioning the array of conductive balls partially within the corresponding apertures.    
   
   
       52 - 63 . (canceled)