Surface acoustic wave device and manufacruring method thereof

Abstract

In the surface acoustic wave device including a lead frame made of metal in which a plurality of inner leads 9 are formed, wherein a chip 1 comprising at least one piezoelectric substrate is mounted on a resin base 3 into which a lead frame is molded integrally, are provided a wire lead section metal surface 7 a that is formed by exposing a wire lead section 7 , which is electrically connected with an electrode of the chip through a bonding wire 4 , out of inner leads that are arranged on both sides of the chip, from the resin base, and a chip lead section metal surface 10 a that is formed by exposing a chip lead section 10 , which is partially covered with the chip, from the resin base.

1 .- 13 . (canceled)  
   
   
       14 . A manufacturing method of a surface acoustic wave device including a lead frame made of metal in which a plurality of inner leads are formed, wherein a chip comprising at least one piezoelectric substrate is mounted on a resin base into which said lead frame is molded integrally, said manufacturing method comprising: 
 exposing a wire lead section, which is electrically connected with an electrode of said chip through a bonding wire, out of said inner leads that are arranged on both sides of said chip, from said resin base to form a wire lead section metal surface; and    exposing a chip lead section, which is partially covered with said chip, out of said inner leads, from said resin base to form a chip lead section metal surface.