US2006196082A1PendingUtilityA1

Modular heel assembly for high heel shoes

Individually held — no corporate assignee on recordPriority: Mar 1, 2005Filed: Feb 28, 2006Published: Sep 7, 2006
Est. expiryMar 1, 2025(expired)· nominal 20-yr term from priority
Inventors:David Robbins
A43B 21/42A43B 3/24A43B 3/246
49
PatentIndex Score
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Cited by
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References
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Claims

Abstract

The present invention relates to a removable modular heel assembly that is attached to a high heel shoe, which shoe may be adapted to accept the assembly, and which assembly is designed to increase the surface area of the heel or shoe to enhance stability, comfort, and/or balance for the wearer.

Claims

exact text as granted — not AI-modified
1 . A device for increasing the surface area of a high heel shoe contacting the ground, comprising: 
 a modular heel unit adapted for attachment to a shoe.    
     
     
         2 . The device of  claim 1 , wherein said shoe is adapted to receive said modular heel unit.  
     
     
         3 . The device of  claim 2 , wherein said modular heel unit comprises a spring-loaded hook on a top surface of the unit, and said shoe comprises a receptacle for receiving said spring-loaded hook.  
     
     
         4 . The device of  claim 2 , wherein said modular heel unit comprises screw threads and said shoe comprises mating screw threads adapted to accept said modular unit screw threads.  
     
     
         5 . The device of  claim 2 , wherein said modular heel unit comprises a snap-on attachment on a top surface of said heel unit, and said shoe is configured with a groove on a portion of a sole adapted to accept said snap-on attachment.  
     
     
         6 . The device of  claim 2 , wherein said modular heel unit comprises a wedge having a body and a leading edge, said unit adapted for receiving a heel of said shoe, said wedge further comprising an insert portion on said leading edge, and at least one attachment means within said body of said wedge; and 
 wherein said shoe comprises an opening on a bottom surface of said shoe oriented to receive said modular unit insert portion.    
     
     
         7 . The device of  claim 5 , wherein said attachment means comprises a pressure-sensitive lever system adapted to fixedly attach said heel of said shoe inside said unit.  
     
     
         8 . A shoe comprising an attachment means adapted for removable attachment of a modular heel unit for said shoe, wherein said modular heel unit is configured to increase the area of said bottom surface of said shoe at a location where said heel is adapted for ground contact.  
     
     
         9 . A device for increasing the surface area of a high heel shoe at a location where a heel of said shoe is adapted for contacting the ground, comprising: 
 a modular heel unit adapted for attachment to a shoe, wherein said shoe is configured to receive said modular heel unit, wherein said modular heel unit comprises a wedge body into which said heel of said shoe fits, said heel unit further comprising an insert portion on the front of said wedge, and wherein said shoe comprises an opening on a bottom surface of said shoe, said opening oriented to receive said modular unit insert portion;    a pressure-sensitive lever system within the body of said modular heel unit adapted to attach to said heel of said shoe inside said unit.

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