Polishing pad for use in polishing work pieces

Abstract

A polishing/lapping pad for use in CMP and other polishing and lapping operations is presented that comprises multiple channels designed to facilitate in the manipulation of slurry into specific locations on the wafer being planarized.

1 . A polishing pad for use in supporting work in CMP and similar polishing and lapping operations, comprising channels cut into the surface to effect the flow of slurry and characterized by concentric pad circles having an axis at the axis of rotation of the rotating pad, improved wherein: 
 said multiple channels are substantially orthogonal to a first pad circle; and    the deviation of the radial component of any of said multiple channels is substantially greater than any deviation of the circular component as said channel extends from the center of the pad outward.    
     
     
         2 . The polishing pad of  claim 1 , wherein at least a subset of said multiple channels comprise a first end and a second end.  
     
     
         3 . The polishing pad of  claim 1 , wherein at least a portion of the length of at least one of said multiple channels extends along the surface of said pad at varying distances from said pad circle.  
     
     
         4 . The polishing pad of  claim 1 , wherein said at least one of said multiple channels circular component deviates outwardly in the same direction said pad rotates.  
     
     
         5 . The polishing pad of  claim 1 , further comprising extra channels to compensate for hotter temperatures on the wafer.  
     
     
         6 . A polishing pad comprising: 
 multiple channels;    wherein said channels are positioned in groups of like shapes having common centers; and    wherein said groups are adjacent to at least one other of said groups, wherein each group has a separate common center.    
     
     
         7 . The polishing pad of  claim 6 , wherein said shapes are circles.  
     
     
         8 . The polishing pad of  claim 7 , wherein each of said groups is adjacent to six other said groups, except at the edges of said pad.  
     
     
         9 . The polishing pad of  claim 8 , wherein each of said groups is adjacent to at least three other of said groups  
     
     
         10 . The polishing pad of  claim 6 , wherein said shapes are hexagons.  
     
     
         11 . The polishing pad of  claim 6 , wherein said shapes are pentagons.