Processing apparatus and processing method

Abstract

A processing apparatus according to the present invention, which conditions a substrate placed on a table equipped with a heater by radiating an electron beam onto the substrate while heating the substrate with the heater, includes at least three projecting portions for holding the substrate at a predetermined distance from the table. This structure minimizes the extent of uneven heating of the substrate, which, in turn, enables uniform processing of the surface on the substrate.

1 . A processing apparatus for conditioning a substrate placed on a table equipped with a heater by radiating an electron beam onto the substrate while heating the substrate with said heater that comprising: 
 at least three projecting portions that hold the substrate at a predetermined distance from said table.    
   
   
       2 . A processing apparatus according to  claim 1 , wherein: 
 said projecting portions are constituted of an electrically conductive material and are electrically grounded via a current detecting means.    
   
   
       3 . A processing apparatus according to  claim 2 , further comprising: 
 a current control means for controlling a current flowing through said current detecting means.    
   
   
       4 . A processing apparatus according to  claim 1 , further comprising: 
 a switch capable of switching said projecting portions between an electrically grounded state and an ungrounded state.    
   
   
       5 . A processing apparatus according to  claim 1 , wherein: 
 said projecting portions are constituted of an electrically conductive material, with a voltage detecting means and a DC power source connected to said projecting portions.    
   
   
       6 . A processing apparatus for conditioning a substrate placed on a table by radiating an electron beam onto the substrate, comprising: 
 a ground wiring that electrically grounds the substrate; and    a current control means disposed at said ground wiring to control a current flowing through said ground wiring.    
   
   
       7 . A processing apparatus according to  claim 6 , wherein: 
 said current control means has a variable resistance element with an adjustable current resistance value.    
   
   
       8 . A processing method for conditioning a substrate placed on a table equipped with a heater by radiating an electron beam onto the substrate while heating the substrate with said heater, wherein: 
 when processing the substrate, the substrate is lifted from said table by a predetermined distance via at least three projecting portions.    
   
   
       9 . A processing method according to  claim 8 , wherein: 
 said projecting portions are constituted of an electrically conductive material and are electrically grounded via a current detecting means.    
   
   
       10 . A processing method according to  claim 9 , wherein: 
 a current control means controls a current flowing through said current detecting means.    
   
   
       11 . A processing method according to  claim 8 , wherein: 
 said projecting portions can be switched to an electrically grounded state or an ungrounded state.    
   
   
       12 . A processing method according to  claim 8 , wherein: 
 said projecting portions are constituted of an electrically conductive material, a voltage detecting means and a DC power source are connected to said projecting portions and a DC voltage is applied to said projecting portions.    
   
   
       13 . A processing method for conditioning a substrate placed on a table by radiating an electron beam onto the substrate, comprising steps for: 
 electrically grounding the substrate via a ground wiring when processing the substrate; and    controlling a current flowing through said ground wiring with a current control means.    
   
   
       14 . A processing method according to  claim 13 , wherein: 
 said current control means has a variable resistance element; and    said method further comprising a step for;    adjusting a current resistance value at said variable resistance element.