Mold cleaning sheet and manufacturing method of a semiconductor device using the same

Abstract

A cleaning sheet with frame for cleaning a molding die comprising a cleaning heat main body that covers the entire mating surface of a molding die and a reinforcing frame which can be disposed along the peripheral edge to the outside of the plural cavities of the mating surface of the molding die, the cleaning sheet main body being formed with first through holes at positions corresponding to the cavities of the molding die, air vent slits and flow cavity recesses at positions corresponding to the air vents of the cavities, second through holes at positions corresponding to the pots of the molding die, and slits at positions corresponding to the runners of the molding die, thereby capable of improving the cleaning effect of the molding die and shortening the time for the cleaning operation to improve the productivity.

1 . A method of manufacturing a semiconductor device comprising the steps of: 
 (a) providing a first mold having a main surface, and a second mold having a main surface and having a first concaved portion on the main surface;    (b) providing a resin containing plural particles;    (c) providing a sheet made of a material that can impregnate and permeate the resin through plural openings in the material, and having through holes each having a diameter larger than that of the plural openings, the through holes each forming a shape which is substantially identical to a diameter of the second concaved portion of the second mold;    (d) opposing and contacting the main surface of the first mold and the main surface of the second mold to each other, and disposing the sheet between the main surface of the first mold and the main surface of the second mold to position the through holes at openings surrounded with the main surface of the first mold and the first concaved portion;    (e) after the step (d), injecting a resin to an inside of the openings surrounded with the main surface of the first mold and the first concaved portion;    (f) after the step (e), removing the sheet on the main surface of the first mold and second mold and the resin;    (g) after the step (f), opposing and contacting the main surface of the first mold and the main surface of the second mold to each other and disposing a semiconductor chip to the inside of the opening surrounded with the main surface of the first mold and the first concaved portion; and    (h) after the step (g), filling an encapsulating resin to the inside of the opening surrounded with the main surface of the first mold and first concaved portion thereby encapsulating the semiconductor chip.    
   
   
       2 . A method of manufacturing a semiconductor device according to  claim 1 , wherein the sheet is a non-woven fabric, paper or net-like material.  
   
   
       3 . A method of manufacturing a semiconductor device according to  claim 1 , wherein the sheet is formed with plural openings each having a diameter larger than that of the particle over an entire surface of the sheet.  
   
   
       4 . A method of manufacturing a semiconductor device according to  claim 1 , wherein the second mold has a second concaved portion on the main surface and the step (e) comprises a step of disposing a resin containing the plural particles to the inside of the second concaved portion and a step of applying heat and pressure to the resin and charging the sane to the inside of the openings.  
   
   
       5 . A method of manufacturing a semiconductor device according to  claim 1 , wherein the particles are formed of silica.  
   
   
       6 . A method of manufacturing a semiconductor device according to  claim 1 , wherein the resin portion of the resin containing the particles is formed of a melamine resin.  
   
   
       7 . A method of manufacturing a semiconductor device according to  claim 1 , wherein the method further comprises, before the step (d), the steps of: 
 (i) opposing and containing the main surface of the first mold and the main surface of the second mold and disposing a semiconductor chip to an inside of the opening surrounded with the main surface of the first mold and the first concaved portion; and    (j) after the step (i), filling an encapsulating resin to the inside of the opening surrounded with the main surface of the first mold and the first concaved portion and encapsulating the semiconductor chip.    
   
   
       8 . A method of manufacturing a semiconductor device comprising the steps of: 
 (a) providing a first mold having a main surface, and a second mold having a main surface and provided with first and second concaved portion on the main surface;    (b) providing a resin containing plural particles;    (c) providing a sheet made of a material that can impregnate and permeate the resin through plural openings in the material, and having through holes each having a diameter larger than that of the plural openings, and having slits formed at portions corresponding to air vents of the first mold;    (d) opposing and contacting the main surface of the first mold and the main surface of the second mold and disposing the sheet between the main surface of the first mold and the main surface of the second mold to situate the first and second concaved portions in the region where the through holes are disposed;    (e) after the step (d), injecting a resin to an inside of the openings surrounded with the main surface of the first mold and the first and second concaved portion, and flowing the resin into the air vents pass through the slits;    (f) after the step (e), removing the sheet and the resin on the main surfaces of the first mold and second mold;    (g) after the step (f), opposing and contacting the main surface of the first mold and the main surface of the second mold, disposing a first semiconductor chip at the inside of a first opening surrounded with the main surface of the first mold and the first concaved portion, and disposing a second semiconductor chip to the inside of a second opening surrounded with the main surface of the first mold and the second concaved portion; and    (h) after the step (g), filling an encapsulating resin to the inside of the first opening and the second opening, and encapsulating the first semiconductor chip and the second semiconductor chip with the encapsulating resin.