Nonthermal plasma processor utilizing additive-gas injection and/or gas extraction

Abstract

A device for processing gases includes a cylindrical housing in which an electrically grounded, metal injection/extraction gas supply tube is disposed. A dielectric tube surrounds the injection/extraction gas supply tube to establish a gas modification passage therearound. Additionally, a metal high voltage electrode circumscribes the dielectric tube. The high voltage electrode is energizable to create nonthermal electrical microdischarges between the high voltage electrode and the injection/extraction gas supply tube across the dielectric tube within the gas modification passage. An injection/extraction gas and a process gas flow through the nonthermal electrical microdischarges within the gas modification passage and a modified process gas results. Using the device contaminants that are entrained in the process gas can be destroyed to yield a cleaner, modified process gas.

1 - 32 . (canceled)  
   
   
       33 . A method for processing gases, comprising: 
 establishing a gas modification passage;    creating nonthermal electrical microdischarges at least partially along the length of the gas modification passage;    providing a process gas to the gas modification passage such that the process gas flows through the nonthermal electrical microdischarges; and    providing an additive gas to the gas modification passage such that the additive gas flows through the nonthermal electrical microdischarges with the process gas.    
   
   
       34 . A method as recited in  claim 33 , wherein the step of creating nonthermal electrical microdischarges comprises: 
 providing at least one high voltage electrode;    providing at least one ground electrode slightly spaced from the high voltage electrode; and    providing at least one dielectric layer disposed between the high voltage electrode and the ground electrode;    wherein the dielectric layer is adjacent to either the high voltage electrode or the ground electrode.    
   
   
       35 . A method as recited in  claim 33 , wherein the step of creating nonthermal electrical microdischarges further comprises: 
 energizing the high voltage electrode to create nonthermal electrical microdischarges between the high voltage electrode and the ground electrode across the dielectric layer.    
   
   
       36 . A method of processing gases, comprising: 
 providing a cylindrical housing;    providing a metal additive gas supply tube within the cylindrical housing, the metal additive gas supply tube being electrically grounded;    providing a first dielectric tube, the first dielectric tube surrounding the additive gas supply tube;    establishing a gas modification passage between the additive gas supply tube and the first dielectric tube; and    providing a metal high voltage electrode, the metal high voltage electrode circumscribing the first dielectric tube, the metal high voltage electrode being energizable to create nonthermal electrical microdischarges between the high voltage electrode and the additive gas supply tube at least partially along the length of the gas modification passage.    
   
   
       37 . A method as recited in  claim 36 , further comprising: 
 providing a process gas supply in fluid communication with the gas modification passage, the process gas supply providing a process gas to the gas modification passage.    
   
   
       38 . A method as recited in  claim 37 , further comprising: 
 providing an additive gas supply in fluid communication with the gas modification passage, the process gas supply providing a process gas to the gas modification passage.    
   
   
       39 . A method as recited in  claim 38 , further comprising: 
 providing a combustion chamber in fluid communication with the gas modification passage, the gas modification passage providing a modified gas to the combustion chamber.    
   
   
       40 . A method as recited in  claim 36 , further comprising: 
 providing a second dielectric tube circumscribing the injection/extraction gas supply tube;    wherein the gas modification passage is established between the first dielectric tube and the second dielectric tube.    
   
   
       41 . A method of processing gases, comprising: 
 providing a high voltage electrode;    providing a ground electrode slightly spaced from the high voltage electrode;    providing a dielectric layer disposed adjacent to the high voltage electrode between the high voltage electrode and the ground electrode;    establishing a gas modification passage within the housing between the dielectric layer and the ground electrode;    providing a process gas inlet configured to deliver a process gas to the gas modification passage; and    providing an additive gas supply inlet configured to inject an additive gas to the gas modification passage.