Method Of Making Microelectronic Spring Contact Array

Abstract

A method of making a microelectronic spring contact array comprises forming a plurality of spring contacts on a sacrificial substrate and then releasing the spring contacts from the sacrificial substrate. Each of the spring contacts has an elongated beam having a base end. The method of making the array includes attaching the spring contacts at their base ends to a base substrate after they have been released entirely from the sacrificial substrate, so that each contact extends from the base substrate to a distal end of its beams. The distal ends are aligned with a predetermined array of tip positions. In an embodiment of the invention, the spring contacts are formed by patterning contours of the spring contacts in a sacrificial layer on the sacrificial substrate. The walls of patterned recesses in the sacrificial layer define side profiles of the spring contacts, and a conductive material is deposited in the recesses to form the elongated beams of the spring contacts.

1 - 40 . (canceled)  
   
   
       41 . A method of making a contact array structure, the method comprising: 
 providing a plurality of loose spring contact structures;    assembling the spring contact structures into an array attached to a first substrate, wherein the assembling comprises positioning the spring contact structures using an alignment substrate; and    removing the spring contact structures from the alignment substrate.    
   
   
       42 . The method of  claim 41 , wherein the assembling further comprises inserting tips of the spring contact structures into alignment features in the alignment substrate.  
   
   
       43 . The method of  claim 42 , wherein the alignment features comprise pits in the alignment substrate.  
   
   
       44 . The method of  claim 43 , wherein the alignment substrate comprises a semiconductor wafer into which the pits are etched.  
   
   
       45 . The method of  claim 41 , wherein the assembling further comprises: 
 inserting bases of the spring contacts into holes in the first substrate; and    inserting tips of the spring contacts into alignment features in the alignment substrate.    
   
   
       46 . The method of  claim 45 , wherein the first substrate comprises bonding material disposed adjacent the holes, and the assembling further comprises activating the bonding material to bond the bases in the holes.  
   
   
       47 . The method of  claim 46 , wherein the bonding material comprises solder.  
   
   
       48 . The method of  claim 41 , wherein the assembling further comprises: 
 inserting tips of the contact structures into alignment features in the alignment substrate; and    securing bases of the contact structures using holding plates.    
   
   
       49 . The method of  claim 48 , forming a substrate around the bases.  
   
   
       50 . The method of  claim 49 , wherein the forming a substrate comprises casting a substrate material around the bases.  
   
   
       51 . The method of  claim 41 , wherein bases of the spring contacts extend through the first substrate, the method further comprising attaching the bases of the spring contacts to a second substrate.  
   
   
       52 . The method of  claim 41  further comprising attaching the first substrate to a probe card device, wherein the spring contacts comprise probes of the probe card device.  
   
   
       53 . The method of  claim 41 , wherein the providing comprises: 
 fabricating the spring contacts on a sacrificial substrate; and    releasing the spring contacts from the sacrificial substrate.    
   
   
       54 . The method of  claim 53 , wherein: 
 the fabricating comprises fabricating the spring contacts in a first orientation on the sacrificial substrate; and    the assembling comprises attaching the spring contacts in a second orientation to the first substrate,    wherein the second orientation is different than the first orientation.    
   
   
       55 . The method of  claim 41 , wherein the positioning the spring contact structures using an alignment substrate comprises aligning mechanical alignment features on the spring contacts with structural alignment features on the alignment substrate.  
   
   
       56 . A method of making a contactor device, the method comprising: 
 fabricating a plurality of loose spring contact structures;    assembling the spring contact structures into an array in which the spring contact structures are aligned by an alignment structure and attached to a first substrate; and    removing the alignment substrate.    
   
   
       57 . The method of  claim 56 , wherein the fabricating comprises: 
 fabricating the spring contacts on a sacrificial substrate; and    releasing the spring contacts from the sacrificial substrate.    
   
   
       58 . The method of  claim 56 , wherein the assembling comprises inserting tips of the spring contact structures into alignment features in the alignment substrate.  
   
   
       59 . The method of  claim 56 , wherein the assembling the spring contact structures into an array comprises aligning mechanical alignment features on the spring contacts with structural alignment features on the alignment substrate.  
   
   
       60 . A method of making a contactor device, the method comprising: 
 providing a plurality of loose spring contact structures;    positioning the spring structures using an alignment substrate;    attaching the spring structures to a first substrate; and    removing the alignment substrate.    
   
   
       61 . The method of  claim 60 , wherein the providing comprises: 
 fabricating the spring contacts on a sacrificial substrate; and    releasing the spring contacts from the sacrificial substrate.    
   
   
       62 . The method of  claim 60 , wherein the positioning comprises inserting tips of the spring contact structures into alignment features in the alignment substrate.  
   
   
       63 . The method of  claim 60 , wherein the attaching comprises inserting bases of the spring contacts through holes in the first substrate, and the method further comprises attaching the bases to a second substrate.  
   
   
       64 . The method of  claim 60 , wherein the positioning the spring structures using an alignment substrate comprises aligning mechanical alignment features on the spring contacts with structural alignment features on the alignment substrate.  
   
   
       65 . A probe card comprising: 
 a plurality of probes attached to a first substrate, tips of the probes positioned in locations corresponding to alignment features in an alignment substrate by which the tips were aligned while attaching the probes to the first substrate; and    an electronic component to which base ends of the probes are attached, wherein the base ends of the probes are opposite the tips of the probes.    
   
   
       66 . The probe card of  claim 65 , wherein the locations in which the tips of the probes are positioned corresponds to the alignment features in the alignment substrate.  
   
   
       67 . The probe card of  claim 65 , wherein the probes comprise mechanical alignment features that correspond to the alignment features of the alignment substrate.  
   
   
       68 . The probe card of  claim 67 , wherein the mechanical alignment features comprise shoulders configured to limit insertion of the tips into the alignment features of the alignment substrate.  
   
   
       69 . The probe card of  claim 65 , wherein the base ends of the probes extend through holes in the first substrate and are attached to terminals of the electronic component.