US2006189483A1PendingUtilityA1
Metal-containing compositions, preparations and uses
Est. expiryAug 31, 2019(expired)· nominal 20-yr term from priority
Inventors:Stephen Spaulding Hickok
A61P 9/10A61P 31/00A61P 31/04A61P 31/18A61P 31/12A61P 35/00A61P 25/20A61P 15/00A61P 11/06A61K 33/26C09D 5/14C02F 1/50A23L 33/165A61K 33/34A61K 33/06A61K 33/04A61K 33/02A01N 59/20A61K 33/42A61K 33/30A23B 2/788Y02A50/30
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Claims
Abstract
A metal containing composition includes (i) at least one water soluble metal compound which forms metal ions when dissolved in water, (ii) at least one metal ion modifier, (iii) at least one acid, and (iv) water. The composition has a pH of less than 6 and an electrolytic potential in excess of 10 millivolts. Such compositions have uses in the prevention and/or treatment of pathogenic disease or disorder, as foodstuff supplements, in the treatment by disinfection of meat and other foodstuffs, in the coating, sealing and plating of metals, and in the treatment of water and sewage.
Claims
exact text as granted — not AI-modified1 . A metal-containing composition substantially comprising
(i) at least one water soluble metal compound which forms metal ions when dissolved in water, (ii) at least one metal ion modifier as herein defined, (iii) at least one acid, and (iv) water said composition having a pH of less than 6 and an electrolytic potential in excess of 10 millivolts.
2 . A composition as claimed in claim 1 wherein said metallic element is one or more of the following mineral metals: copper, magnesium, selenium, iron and zinc.
3 . A composition as claimed in claim 1 or 2 which essentially consists of (i)-(iv) as defined in claim 1 .
4 . A composition as claimed in any preceding claim which consists of (i)-(iv) as defined in claim 1 apart from any unavoidable impurities.
5 . A composition as claimed in any preceding claim wherein (i) is an inorganic salt of zinc, magnesium, copper, selenium, iron, nickel, titanium or vanadium.
6 . A composition as claimed in claim 5 in which said salt (i) is sulphate, chloride or nitrate.
7 . A composition as claimed in claim 5 or 6 in which said salt (i) is a zinc, magnesium, copper, iron or selenium salt.
8 . A composition as claimed in claim 7 in which (i) is zinc sulphate, magnesium sulphate, iron sulphate or copper sulphate.
9 . A composition as claimed in any preceding claim in which the metal ion modifier (ii) is at least one metal ion binding, complexing, or sequestering agent.
10 . A composition as claimed in any preceding claim wherein (ii) comprises one or more inorganic ammonium compounds capable of dissociating in water into ammonium ions such as one or more of: ammonium sulphate, ammonium chloride, ammonium phosphate, and ammonium citrate.
11 . A composition as claimed in claim 10 wherein (ii) is ammonium sulphate.
12 . A composition as claimed in any preceding claim in which (iii) comprises one or more of sulphuric, hydrochloric, phosphoric and citric acids.
13 . A composition as claimed in claim 12 wherein (iii) is concentrated sulphuric or hydrochloric acid.
14 . A composition as claimed in any preceding claim in which (iv) consists essentially of distilled water or entirely of distilled water apart from any unavoidable impurities.
15 . A composition as claimed in any preceding claim in which the pH value is less than 5, preferably less than 4, more preferably less than 3, most preferably less than 2.5.
16 . A composition as claimed in claim 15 in which the pH value is 2 or less such as in the range of 1 to 2.
17 . A composition as claimed in any preceding claim in which the electrolytic potential is in excess of 20 millivolts, preferably in excess of 50 millivolts and more preferably in excess of 100 millivolts.
18 . A composition as claimed in claim 17 in which the electrolytic potential is in excess of 200 millivolts.
19 . A composition as claimed in claim 18 in which the electrolytic potential is in excess of 300 millivolts and preferably at least 340 millivolts.
20 . A composition as claimed in claim 19 in which the electrolytic potential is in the range of 340 to 400 millivolts.
21 . A method of making a composition as claimed in any preceding claim comprising dissolving (i) in distilled water, adding (ii) and mixing or allowing to dissolve, then adding (iii) whilst simultaneously monitoring the pH and electrolytic potential of the composition until a required value of each measurement is obtained.
22 . A method as claimed in claim 21 in which (i) is as defined in any one of claims 5 to 8 .
23 . A method as claimed in claim 21 or 22 in which (ii) is as defined in any one of claims 9 to 11 .
24 . A method as claimed in any one of claims 21 to 23 wherein (iii) is as defined in claim 12 or 13 .
25 . Use of a composition as claimed in any one of claims 1 to 21 as a medicament for treating or preventing a pathogenic disease or disorder.
26 . A composition as claimed in any one of claims 1 to 21 for the preparation of a medicament for treating or preventing a pathogenic disease or disorder.
27 . Use of a composition as claimed in any one of claims 1 to 21 as an antimicrobial, antiviral, anti-retrovirus, or antifungal formulation.
28 . An antimicrobial, antiviral, antiretrovirus or antifungal formulation comprising a composition as claimed in any one of claims 1 to 21 in conjunction with a pharmaceutically acceptable carrier, diluent or excipient therefor.
29 . Use of a composition as claimed in any one of claims 1 to 21 for the treatment of water, or predominantly water-containing material.
30 . Use of a composition as claimed in any one of claims 1 to 21 for the treatment of sewage, industrial or municipal wastes.
31 . Use of a composition as claimed in any one of claims 1 to 21 for the treatment of foodstuffs as a disinfectant or bactericide, particularly copper containing such compositions.
32 . Use of a composition as claimed in any one of claims 1 to 21 for the preservation of plants, flowers, trees or shrubs.
33 . Use of a composition as claimed in any one of claims 1 to 21 in the treatment of a metal for coating, sealing, plating or otherwise forming an anti-corrosive layer upon a metallic substrate.
34 . Use as claimed in claim 33 wherein the composition contains one or more of copper, nickel, titanium or vanadium.Join the waitlist — get patent alerts
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