Customized polishing pads for CMP and methods of fabrication and use thereof

Abstract

Various examples of customized polishing pads are given, along with methods of making and using such customized polishing pads. The subject customized pads are designed and fabricated so that there is spatial distribution of chemical and physical properties of the pads that are customized for performance suited to a specific type of substrate, as well as fabrication control in implementing such customized design. Such customized design and fabrication control produce a monolithic pad thereby specifically suited to provide uniform performance of CMP of the targeted substrate.

1 . An article for polishing a substrate by CMP, said article comprising: 
 a polymeric polishing pad formed in situ and having:    a first region and a second region, wherein the first region has a polishing face of the pad and the second region is adjacent to the first region;    a shear relieving interface between the first and second regions; and    at least one solid lubricant dispersed within at least the first region.