US2006180915A1PendingUtilityA1
Semiconductor package using terminals formed on a conductive layer of a circuit board
Individually held — no corporate assignee on recordPriority: Jun 11, 1998Filed: Apr 12, 2006Published: Aug 17, 2006
Est. expiryJun 11, 2018(expired)· nominal 20-yr term from priority
Inventors:Robert F. Wallace
H10W 72/30H10W 72/20H10W 90/00H10W 76/47H10W 74/111H10W 74/016H10W 70/699H10W 70/611H05K 1/117H05K 3/284H05K 2201/10689G11C 5/06G11C 16/04G11C 29/48G11C 29/1201H05K 1/0268H05K 2201/09127H05K 2201/2018H05K 3/0052G11C 5/04
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Claims
Abstract
A small package is provided for a flash EEPROM memory. The small package uses terminals which are part of a bottom conductive layer of a circuit board. In this manner, the final package can be quite thin. The circuit board can be connected to the integrated circuits and passive devices and can be encapsulated in plastic or glued to a plastic cover. In this manner, a thin and relatively inexpensive package can be formed. Additionally, the circuit board can have testing connections which can be removed before forming the final package.
Claims
exact text as granted — not AI-modified1 . A package including:
a circuit board; a set of circuit elements on the circuit board, the set of circuit elements including at least one integrated circuit and passive components; and packaging material surrounding the set of circuit elements and part of the circuit board, wherein one side of the circuit board includes a set of terminals that are visible from the side of the package, the set of terminals being positioned away from the edge of the circuit board.
2 . The package of claim 1 , wherein the packaging material includes molded plastic.
3 . The package of claim 2 , wherein the packaging material includes a bordering frame.
4 . The package of claim 1 , wherein one side of the circuit board is exposed.
5 . The package of claim 4 , wherein the exposed side of the circuit board material includes the set of terminals connected to the remainder of the circuit board by vias.
6 . The package of claim 5 , wherein the circuit board material is attached to the packaging material by epoxy.
7 . The package of claim 1 , wherein the circuit elements include at least two integrated circuits and passive devices.
8 . The package of claim 7 , wherein the thickness of the package is less than 12 mils.
9 . The package of claim 1 , wherein the package is a flash EEPROM package.
10 . A package including:
a circuit board; at least one integrated circuit on the circuit board; and packaging material surrounding the set of circuit elements and part of the circuit board, wherein one side of the circuit board is exposed, the exposed side of the circuit board material including a set of terminals connected to the remainder of the circuit board by vias.
11 . The package of claim 10 , wherein the circuit board material is attached to the packaging material by epoxy.
12 . The package of claim 10 , wherein on the exposed side of the circuit board only the set of terminals is exposed.
13 . The package of claim 10 , wherein the circuit elements include at least two integrated circuits and passive devices.
14 . The package of claim 10 , wherein the thickness of the package is less than 12 mils.
15 . The package of claim 10 , wherein the package is a flash EEPROM package.
16 . A package including:
a circuit board; a set of circuit elements on the circuit board, the set of circuit elements including at least one integrated circuit and passive components; and a plastic material encasing the set of circuit elements and part of the circuit board, wherein one side of the circuit board includes a set of terminals that are accessible from the side of the package, the set of terminals being positioned away from the edge of the circuit board.
17 . The package of claim 16 , wherein one side of the circuit board is exposed.
18 . The package of claim 17 , wherein the exposed side of the circuit board material includes the set of terminals connected to the remainder of the circuit board by vias.
19 . The package of claim 16 , wherein the circuit board material is attached to the packaging material by epoxy.
20 . The package of claim 16 , wherein on the exposed side of the circuit board only the set of terminals is exposed.Join the waitlist — get patent alerts
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