Packaged microelectronic devices with pressure release elements and methods for manufacturing and using such packaged microelectonic devices

Abstract

Packaged microelectronic devices, interconnecting units for packaged microelectronic devices, and methods and apparatuses for packaging microelectronic devices with pressure release elements. In one aspect of the invention, a packaged microelectronic device includes a microelectronic die, an interconnecting unit coupled to the die, and a protective casing over the die. The interconnecting unit can have a substrate with a first side and a second side to which the die is attached, a plurality of contact elements operatively coupled to corresponding bond-pads on the die, and a plurality of ball-pads on the first side of the substrate electrically coupled to the contact elements. The protective casing can have at least a first cover encapsulating the die on the first side of the substrate. The packaged microelectronic device can also include a pressure relief element through at least a portion of the first cover and/or the substrate. The pressure relief element can have an opening to an external environment and a passageway to an internal location within the packaged microelectronic device. In operation, the pressure relief element releases gases or other forms of moisture entrapped by the casing and/or the substrate during high temperature processing of the packaged microelectronic device.

1 . A packaged microelectronic device, comprising: 
 a microelectronic die having an integrated circuit and a bond-pad array having a plurality of bond-pads operatively coupled to the integrated circuit;    an interconnecting unit having a substrate with a first side and a second side to which the die is attached, a plurality of contact elements operatively coupled to corresponding bond-pads on the die, a plurality of ball-pads on the first side, and a plurality of conductive elements extending from selected contact elements to corresponding ball-pads;    a protective casing having at least a first cover encapsulating the die on the second side of the substrate; and    a pressure relief element through at least a portion of the first cover and/or the substrate, the pressure relief element having an opening to an external environment and a passageway to an internal location.    
     
     
         2 . The device of  claim 1  wherein the pressure relief element is a hole completely through the substrate such that the opening is at the first side of the substrate and the internal location is at the second side of the substrate.  
     
     
         3 . The device of  claim 2  wherein: 
 the microelectronic die is attached to the second side of the substrate by an adhesive; and    the pressure relief element is over the adhesive such that the adhesive is exposed to the external environment through the passageway.    
     
     
         4 . The device of  claim 1  wherein the pressure relief element is an elongated channel completely through the substrate such that the opening is at the first side of the substrate and the internal location is at the second side of the substrate.  
     
     
         5 . The device of  claim 4  wherein: 
 the microelectronic die is attached to the second side of the substrate by an adhesive; and    the pressure relief element is over the adhesive such that the adhesive is exposed to the external environment through the passageway.    
     
     
         6 . The device of  claim 1  wherein the pressure relief element is a depression in the substrate that does not pass completely through the substrate such that the opening is at the first side of the substrate and the internal location is at an intermediate depth within the substrate, the substrate having a thickness between the internal location and the second side that is configured to rupture at a predetermined pressure.  
     
     
         7 . The device of  claim 6  wherein: 
 the microelectronic die is attached to the second side of the substrate by an adhesive; and    the depression is over the adhesive.    
     
     
         8 . The device of  claim 1  wherein the pressure relief element is a hole completely through the first cover such that the internal location is at a backside of the die.  
     
     
         9 . The device of  claim 1  wherein the pressure relief element is a depression in the first cover that does not pass completely through the first cover such that the internal location is at an intermediate depth within the first cover, the first cover having a thickness between the internal location and a backside of the die that is configured to rupture at a predetermined pressure.  
     
     
         10 . A packaged microelectronic device, comprising: 
 a microelectronic die having an integrated circuit and a bond-pad array having a plurality of bond-pads operatively coupled to the integrated circuit;    an interconnecting unit having a substrate with a first side and a second side to which the die is attached, a plurality of contact elements operatively coupled to corresponding bond-pads on the die, a plurality of ball-pads on the first side, and a plurality of conductive elements extending from selected contact elements to corresponding ball-pads;    a protective casing having at least a first cover encapsulating the die on the second side of the substrate; and    a pressure relief element through at least a portion of the first cover and/or the substrate, the pressure relief element being configured to release a gas entrapped by the casing and/or the substrate.    
     
     
         11 . The device of  claim 10  wherein the pressure relief element is a hole completely through the substrate such that the opening is at the first side of the substrate and the internal location is at the second side of the substrate.  
     
     
         12 . The device of  claim 11  wherein: 
 the microelectronic die is attached to the second side of the substrate by an adhesive; and    the pressure relief element is over the adhesive such that the adhesive is exposed to the external environment through the passageway.    
     
     
         13 . The device of  claim 10  wherein the pressure relief element is an elongated channel completely through the substrate such that the opening is at the first side of the substrate and the internal location is at the second side of the substrate.  
     
     
         14 . The device of  claim 13  wherein: 
 the microelectronic die is attached to the second side of the substrate by an adhesive; and    the pressure relief element is over the adhesive such that the adhesive is exposed to the external environment through the passageway.    
     
     
         15 . The device of  claim 10  wherein the pressure relief element is a depression in the substrate that does not pass completely through the substrate such that the opening is at the first side of the substrate and the internal location is at an intermediate depth within the substrate, the substrate having a thickness between the internal location and the second side that is configured to rupture at a predetermined pressure.  
     
     
         16 . The device of  claim 15  wherein: 
 the microelectronic die is attached to the second side of the substrate by an adhesive; and    the depression is over the adhesive.    
     
     
         17 . The device of  claim 10  wherein the pressure relief element is a hole completely through the first cover such that the internal location is at a backside of the die.  
     
     
         18 . The device of  claim 10  wherein the pressure relief element is a depression in the first cover that does not pass completely through the first cover such that the internal location is at an intermediate depth within the first cover, the first cover having a thickness between the internal location and a backside of the die that is configured to rupture at a predetermined pressure.  
     
     
         19 . A packaged microelectronic device, comprising: 
 an interconnecting unit having a substrate with a first side and a second side, a slot defining an open region between the first and second sides, a plurality of contact elements on the first side and adjacent to the slot, a plurality of ball-pads on the first side, and a plurality of conductive elements on the first side extending from selected contact elements to corresponding ball-pads;    a microelectronic die having an integrated circuit and a plurality of bond-pads operatively coupled to the integrated circuit, the die being attached to the second side of the substrates, and the bond-pads being aligned with the slot;    a plurality of wire-bond lines in the slot extending between selected bond-pads on the die and corresponding contact elements on the substrate;    a protective casing having a first cover encapsulating the die on the second side of the substrate and a second cover encapsulating the bond-pads, the wire-bond lines and the contact elements; and    a first pressure relief element through at least a portion of the first cover and/or the substrate, the pressure relief element being configured to release a gas entrapped by the casing and/or the substrate.    
     
     
         20 . The device of  claim 19  wherein the pressure relief element is a hole completely through the substrate such that the opening is at the first side of the substrate and the internal location is at the second side of the substrate.  
     
     
         21 - 49 . (canceled)