US2006177955A1PendingUtilityA1
Process for making a CMOS image sensor
Individually held — no corporate assignee on recordPriority: Jan 8, 2004Filed: Mar 17, 2006Published: Aug 10, 2006
Est. expiryJan 8, 2024(expired)· nominal 20-yr term from priority
Inventors:James P. Lavine
H10F 39/026
53
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Claims
Abstract
An image sensor includes a semi-conducting substrate having a photo-sensitive region and doping for forming a path to a charge-to-voltage mechanism; a dielectric spanning the substrate; and a semi-conducting layer, which is less than approximately 1 micrometer, spanning the dielectric which contains electrodes and circuit elements that control flow of charge.
Claims
exact text as granted — not AI-modified1 . A method for creating an image sensor comprising the steps of:
(a) providing a substrate; (b) providing the substrate with a dielectric; (c) providing a single crystal, semi-conducting layer which is approximately 1 micrometer on the dielectric which contains electrodes and circuit elements that control flow of charge; and (d) implanting through the dielectric and semi-conducting layer into the substrate for forming a photo-sensitive region, a transfer gate channel and charge-to-voltage mechanism.
2 . The method as in claim 1 further comprising forming an isolation region adjacent the photodiode.
3 . A method for creating an image sensor comprising the steps of:
(a) forming a substrate; (b) covering the substrate with a dielectric; (c) implanting through the dielectric into the substrate for forming a photodiode, a transfer gate channel and floating diffusion; and (d) bonding a single crystal, semi-conducting layer which is approximately 1 micrometer onto the dielectric which contains electrodes and circuit elements that control flow of charge.
4 . The method as in claim 3 further comprising forming an epitaxial layer as a portion of the substrate.
5 . The method as in claim 1 further comprising forming an epitaxial layer as a portion of the substrate.Join the waitlist — get patent alerts
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