Method of making printed wiring board and method of forming plating film

Abstract

A current is supplied to first and second electrically-conductive resistances located away from each other on a straight line defined on an electrically-insulating substrate in a method of making a printed wiring board. A contour of the substrate is formed along the straight line based on the detected resistance values. The method allows an increase in the resistance values of the first and second electrically-conductive resistances in response to reduction of the first and second electrically-conductive resistances, respectively. The resistance values are thus utilized to determine the contour of the electrically-insulating substrate. Any process of defining the contour can be finished based on the determination of the contour. This enables establishment of the contour as designed with a higher accuracy.

1 . A method of making a printed wiring board, comprising: 
 supplying a current to first and second electrically-conductive resistances located away from each other on a straight line defined on an electrically-insulating substrate;    detecting resistance values of the first and second electrically-conductive resistances based on the current; and    forming a contour of the substrate along the straight line based on the resistance values.    
   
   
       2 . The method according to  claim 1 , wherein the first and second electrically-conductive resistances are contoured in an identical shape in advance of forming said contour.  
   
   
       3 . The method according to  claim 1 , wherein the resistance value of the first electrically-conductive resistance is compared with a predetermined reference value in forming said contour.  
   
   
       4 . A method of making a printed wiring board, comprising: 
 supplying a current to first and second electrically-conductive resistances located away from each other on a first straight line defined on an electrically-insulating substrate;    detecting resistance values of the first and second electrically-conductive resistances based on the current;    forming a first contour of the substrate along the first straight line based on the resistance values from the first and second electrically-conductive resistances;    supplying a current to third and fourth electrically-conductive resistances located away from each other on a second straight line orthogonal to the first straight line defined on the electrically-insulating substrate;    detecting resistance values of the third and fourth electrically-conductive resistances based on the current; and    forming a second contour of the substrate along the second straight line based on the resistance values from the third and fourth electrically-conductive resistances.    
   
   
       5 . The method according to  claim 4 , wherein the first and second electrically-conductive resistances are contoured in an identical shape in advance of forming said first contour.  
   
   
       6 . The method according to  claim 4 , wherein the resistance values of the first and third electrically-conductive resistances are compared with predetermined reference values in forming said first and second contours.  
   
   
       7 . A printed wiring board, comprising: 
 an electrically-insulating substrate having first and second contours defined along imaginary planes orthogonal to each other:    an electrically-conductive terminal pad formed on the substrate;    a first electrically-conductive resistance formed on the substrate along the first contour;    a pair of first electrically-conductive pads formed on the substrate, the first electrically-conductive pads connected to the first electrically-conductive resistance;    a second electrically-conductive resistance formed on the substrate along the first contour away from the first electrically-conductive resistance;    a pair of second electrically-conductive pads formed on the substrate, the second electrically-conductive pads connected to the second electrically-conductive resistance;    a third electrically-conductive resistance formed on the substrate along a second contour;    a pair of third electrically-conductive pads formed on the substrate, the third electrically-conductive pads connected to the third electrically-conductive resistance;    a fourth electrically-conductive resistance formed along the second contour away from the third electrically-conductive resistance on the substrate; and    a pair of fourth electrically-conductive pads formed on the substrate, the fourth electrically-conductive pads connected to the fourth electrically-conductive resistance, wherein    resistance value of the first electrically-conductive resistance detected out of the first electrically-conductive pads is set equal to resistance value of the second electrically-conductive resistance detected out of the second electrically-conductive pads, and resistance value of the third electrically-conductive resistance detected out of the second electrically-conductive pads is set equal to resistance value of the fourth electrically-conductive resistance detected out of the fourth electrically-conductive pads.    
   
   
       8 . The printed wiring board according to  claim 7 , wherein said terminal pad comprises: 
 a first electrically-conductive layer extending over the substrate;    a substitution layer extending over a surface of the first electrically-conductive layer, the substitution layer made of a material inducing substitution reaction to a given metal; and    a plating film received on a surface of the substitution layer, the plating film made of said given metal.    
   
   
       9 . The printed wiring board according to  claim 8 , wherein said first to fourth electrically-conductive resistances comprise: 
 a substitution layer extending over said substrate, the substitution layer made of said material; and    a plating film received on a surface of the substitution layer, the plating film made of said given metal.    
   
   
       10 . A method of making a plating film, comprising: 
 forming a resist film of a first pattern on an electrically-insulating plate;    forming a plating film of a metal material on the electrically-insulating plate based on the first pattern after formation of the resist film;    removing the resist film of the first pattern; and    forming a plating film of the metal material based on the first pattern and a second pattern different from the first pattern after removal of the resist film.