US2006169113A1PendingUtilityA1

Blade assembly cover

Individually held — no corporate assignee on recordPriority: Oct 30, 2001Filed: Mar 30, 2006Published: Aug 3, 2006
Est. expiryOct 30, 2021(expired)· nominal 20-yr term from priority
Inventors:Ernest Hamilton
Y10T83/2066Y10T83/7734B26D 3/22B26D 7/088B26D 7/22B28D 5/0076B28D 5/029Y10T407/1902Y10T83/2083Y10T83/04Y10T83/872Y10T83/0453Y10T83/242Y10T83/0448Y10T83/0341Y10T83/2072
46
PatentIndex Score
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Cited by
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References
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Claims

Abstract

A gang blade assembly which controls the trajectory of detritus from a ball grid array substrate dicing operation is described. The assembly includes a cover which partially encases a hub with a plurality of blades. A brush is mounted on the cover to disrupt an air flow created by rotation of the hub and blades. The brush extends beneath the cover and has bristles which contact the hub. The bristles also serve to clear the hub of any detritus produced during dicing. More than one brush may be mounted on the cover.

Claims

exact text as granted — not AI-modified
1 . A blade assembly, comprising: 
 a blade device, comprising: 
 a hub;  
 at least one semiconductor cutting blade on said hub;  
 a cover partially encasing said blade device; and  
 a brush mounted on said cover and extending toward said hub and extending across said at least one blade on said hub, wherein said brush is located on a line tangent to an outer edge of said blade device, and wherein said brush includes bristles which contact said hub.  
   
   
   
       2 . The blade assembly of  claim 1 , wherein said hub is generally circular in profile.  
   
   
       3 . (canceled)  
   
   
       4 . The blade assembly of  claim 1 , wherein said bristles contact said hub perpendicular to a surface of the hub.  
   
   
       5 . The blade assembly of  claim 1 , wherein said brush extends across all the at least one blade on said hub.  
   
   
       6 . The blade assembly of  claim 1 , comprising a plurality of semiconductor cutting blades spaced apart from each other on said hub.  
   
   
       7 . The blade assembly of  claim 1 , comprising a water nozzle directed toward said at least one semiconductor cutting blade.  
   
   
       8 . The blade assembly of  claim 7 , comprising a shield mounted on a leading side of said cover.  
   
   
       9 . The blade assembly of  claim 1 , further comprising a bracket, wherein said brush is mounted on said bracket.  
   
   
       10 . The blade assembly of  claim 9  further comprising a deflector mounted on said bracket.  
   
   
       11 . The blade assembly of  claim 10  wherein said deflector extends above said cover.  
   
   
       12 . The blade assembly of  claim 11  wherein said deflector extends below said cover.  
   
   
       13 . The blade assembly of  claim 9  wherein said cover includes a trailing side, said bracket being mounted on said trailing side.  
   
   
       14 . The blade assembly of  claim 13  wherein said cover includes a leading side.  
   
   
       15 . The blade assembly of  claim 14  wherein said cover includes a top side extending between said trailing and leading sides.  
   
   
       16 . The blade assembly of  claim 15  wherein said top side is arched.  
   
   
       17 - 46 . (canceled)  
   
   
       47 . A blade assembly for cutting semiconductor products, comprising: 
 a blade device, comprising: 
 a hub; and  
 at least one semiconductor cutting blade on said hub;  
 a cover over said blade device;  
 at least one brush mounted on said cover, wherein said brush includes bristles which contact a surface of said hub.

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