Electronic device manufacture

Abstract

Compositions suitable for use as underfill materials in an integrated circuit assembly are provided. Also provided are methods of preparing integrated circuit assemblies containing certain underfill materials as well as electronic devices containing such integrated circuit assemblies.

1 . A re-moldable polymeric resin suitable for use in an integrated circuit assembly comprising as polymerized units one or more dienophiles and one or more dienes, wherein at least one diene contains at least a pair of conjugated double bonds capable of undergoing a Diels-Alder reaction and having at least one hydrogen on the first and fourth carbons of the conjugated double bonds.  
     
     
         2 . The re-moldable polymeric resin of  claim 1  wherein at least one diene has the formula  
       
         
           
           
               
               
           
         
       
       where R 1 , R 2 , R 3  and R 4  are independently selected from hydrogen, alkyl, alkenyl, aryl, heteroatoms, and substituted heteroatoms; and R 1  and R 2  or R 3  and R 4  may be taken together to form a cyclodiene.  
     
     
         3 . The re-moldable polymeric resin of  claim 1  wherein at least one diene has the formula  
       
         
           
           
               
               
           
         
       
       wherein Z is selected from alkyl, alkenyl, aryl, arylene ether, alkylaryl, (meth)acrylic moiety, epoxy moiety, and siloxane moiety.  
     
     
         4 . The re-moldable polymeric resin of  claim 1  wherein at least one dienophile contains one or more Diels-Alder participating double bonds where at least 2 substituents on the olefinic carbons are hydrogen.  
     
     
         5 - 10 . (canceled)