Optical disk polishing device

Abstract

An apparatus for polishing an optical disk according to the present invention includes a flange 24 holding a polishing body 20 such as sandpaper, a backup member 21 interposed between the polishing body 20 and the flange 24 , a rotation table 12 holding an optical disk 10 as a polished body, a pressing unit 28 for pressing the polishing body 20 against the optical disk 10 with a predetermined contact pressure required for polishing and motors 26 and 14 for rotationally driving the flange 24 and the rotation table 12 respectively. The backup member 21 is deformable within the range of 0.05 to 0.3 mm when pressed with the predetermined contact pressure, which makes it possible to substantially equalize the contact pressure of the polishing body 20 against the optical disk 10 on the entire polishing surface and to prevent the occurrence of roundness on the periphery of the optical disk.

1 . An apparatus for polishing an optical disk comprising: 
 a) a rotatable polished body holder for holding a polished body;    b) a rotatable polishing body holder for holding a polishing body;    c) a buffer member provided between the polishing body and the polishing body holder, which is deformable within the range of 0.05 to 0.3 mm when pressed with a predetermined contact pressure required for polishing;    d) a driver for rotationally driving the polishing body holder and/or the polished body holder; and    e) a pressing unit for pressing the polishing body holder and the polished body holder against each other with the predetermined contact pressure.    
   
   
       2 . The apparatus for polishing an optical disk according to  claim 1 , wherein the deformation amount of the buffer member is between 0.1 and 0.2 mm.  
   
   
       3 . The apparatus for polishing an optical disk according to  claim 1 , wherein a rigid member is provided between the buffer member and the polishing body holder.  
   
   
       4 . The apparatus for polishing an optical disk according to  claim 2 , wherein a rigid member is provided between the buffer member and the polishing body holder.