US2006163761A1PendingUtilityA1
Process to produce a resin-cemented optical element
Est. expiryJul 23, 2019(expired)· nominal 20-yr term from priority
B29D 11/00B29C 43/18B29D 11/0073G02B 3/04B29L 2011/0016Y10T428/31601Y10T428/31649
56
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Claims
Abstract
A process to produce a resin-cemented optical element having a base member and a resin layer formed on the surface of the base member and having a cured product of a photosensitive resin composition. The resin layer has (1) a refractive index of 1.55 or more, (2) a visible-light inner transmittance of 95% or more in a 100 μm thick area, (3) a rate of hygroscopic dimensional change of 0.4% or less, (4) a durometer hardness of HDD 70 or more, (5) a gel percentage of 95% or more, (6) a glass transition temperature of 95° C. or above or (7) a rate of shrinkage on curing of 7% or less.
Claims
exact text as granted — not AI-modified1 . A process to produce a resin-cemented optical element, the process comprising:
a first exposure operation of irradiating a photosensitive resin composition held between the surface of a base member and a mold tool, to cure the composition to form a resin layer; a mold release operation of mold-releasing the resin layer; and a heating operation of heating the resin layer, in this order.
2 . A process to produce a resin-cemented optical element, the process comprising:
a first exposure operation of irradiating a photosensitive resin composition held between the surface of a base member and a mold tool, with heating to cure the composition to form a resin layer; and a mold release operation of mold-releasing the resin layer, in this order.
3 . The process to produce a resin-cemented optical element according to claim 2 , wherein the heating in said first exposure operation is carried out at a temperature of from 40° C. to 130° C.
4 . A process to produce a resin-cemented optical element, the process comprising:
one or more exposure operations of irradiating a photosensitive resin composition held between the surface of a base member and a molding tool, to cure the composition to form a resin layer; and at least one of said exposure operations being the operation of irradiating the resin composition by light not comprising light with a wavelength less than 300 nm.
5 . The process to produce a resin-cemented optical element according to claim 4 , further comprising a mold release operation of mold-releasing the resin layer;
said operation of irradiating the resin composition by the light not comprising light with a wavelength of less than 300 nm being a first exposure operation carried out before said mold release operation.
6 . The process to produce a resin-cemented optical element according to claim 4 , further comprising a mold release operation of mold-releasing the resin layer;
said operation of irradiating the resin composition by the light not comprising light with a wavelength of less than 300 nm being a second exposure operation carried out after said mold release operation.
7 . The process to produce a resin-cemented optical element according to claim 1 , further comprising, after said mold release operation, a second exposure operation of irradiating the resin layer by light not comprising light with a wavelength of less than 300 nm.
8 . The process to produce a resin-cemented optical element according to claim 4 , wherein the irradiation in the operation of irradiation by the light not comprising light with a wavelength of less than 300 nm is performed shutting out light with a wavelength of less than 300 nm among light emitted from a light source.
9 . The process to produce a resin-cemented optical element according to claim 2 , further comprising, after said mold release operation, a heating operation of heating the resin layer.
10 . The process to produce a resin-cemented optical element according to claim 6 , further comprising, after said second exposure operation, a heating operation of heating the resin layer.
11 . The process to produce a resin-cemented optical element according to claim 1 , wherein the heating in said heating operation is carried out at a temperature of from 40° C. to 130° C.
12 . The process to produce a resin-cemented optical element according to claim 1 , wherein said resin composition comprises:
a polyfunctional (meth) acrylate; a polyfunctional urethane-modified (meth) acrylate; and a photopolymerization initiator.
13 . The process to produce a resin-cemented optical element according to claim 2 , further comprising, after said mold release operation, a second exposure operation of irradiating the resin layer by light not comprising light with a wavelength of less than 300 nm.
14 . The process to produce a resin-cemented optical element according to claim 5 , further comprising, after said mold release operation, a second exposure operation of irradiating the resin layer by light not comprising light with a wavelength of less than 300 nm.
15 . The process to produce a resin-cemented optical element according to claim 9 , wherein the heating in said heating operation is carried out at a temperature of from 40° C. to 130 C°.
16 . The process to produce a resin-cemented optical element according to claim 10 , wherein the heating in said heating operation is carried out at a temperature of from 40° C. to 130 C°.
17 . The process to produce a resin-cemented optical element according to claim 2 , wherein said resin composition comprises:
a polyfunctional (meth) acrylate; a polyfunctional urethane-modified (meth) acrylate; and a photopolymerization initiator.
18 . The process to produce a resin-cemented optical element according to claim 4 , wherein said resin composition comprises:
a polyfunctional (meth) acrylate; a polyfunctional urethane-modified (meth) acrylate; and a photopolymerization initiator.
19 . The process to produce a resin-cemented optical element according to claim 5 , further comprising, after said mold release operation, a heating operation of heating the resin layer.Join the waitlist — get patent alerts
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