Chip-based CPU cooler and cooling method thereof

Abstract

Provided are chip-based CPU cooling device and cooling method thereof. The cooling device comprises a metal cover adapted to completely cover and contact the CPU, a hollow seat, a thermal electric cooler shaped to fit in the seat and adapted to contact the cover, a heat dissipation member (e.g., fins) enclosed by a housing and mounted on the seat for contacting the thermal electric cooler, a first fan mounted on top of the housing, and a second fan mounted on side of the housing. An optimum heat dissipation can be obtained by running a control program to control on/off of the fans and power of the thermal electric cooler by operating the cooling device in one of a plurality of corresponding temperature ranges of the CPU.

1 . A chip-based cooling device mountable on a CPU arranged on a motherboard, comprising a metal cover, a hollow seat, a thermal electric cooler, a heat dissipation member, a housing, a first fan, and a second fan wherein the cover is adapted to completely cover and contact the CPU, the cover is also adapted to contact a bottom of the thermal electric cooler, the thermal electric cooler is shaped to fit in the seat, the housing is mounted on a top of the seat, the heat dissipation member is enclosed by the housing, the first fan is mounted on a top of the housing, the second fan is mounted on a side of the housing, and a bottom of the heat dissipation member is adapted to contact a top of the thermal electric cooler.  
   
   
       2 . The cooling device of  claim 1 , wherein each of the seat and the housing comprises an outer wall, an inner wall, and a groove defined by the walls for direct air communication with the cover or the heat dissipation member.  
   
   
       3 . The cooling device of  claim 2 , wherein the seat further comprises a central opening for receiving the thermal electric cooler.  
   
   
       4 . The cooling device of  claim 2 , wherein the housing further comprises a central passageway defined by the inner wall for receiving the heat dissipation member, an upper opening with the first fan mounted thereon, and an inclined passage at one side, the passage having an opening at an open end with the second fan mounted thereon.  
   
   
       5 . The cooling device of  claim 4 , wherein the first fan is adapted to dissipate heat to the ambient and the second fan is adapted to draw external cold air into the housing.  
   
   
       6 . The cooling device of  claim 1 , further comprising a hollow frame comprising a central opening shaped to put the thermal electric cooler therein such that the thermal electric cooler therein is adapted to upwardly project from the seat.  
   
   
       7 . The cooling device of  claim 1 , wherein the heat dissipation member is a heat sink.  
   
   
       8 . The cooling device of  claim 1 , wherein the heat dissipation member is a heat pipe.  
   
   
       9 . In a chip-based cooling device mountable on a CPU arranged on a motherboard, the cooling device including a thermal electric cooler including a heat dissipating surface and a heat absorbing surface wherein electricity is produced by heating a junction between the heat absorbing surface and the heat dissipating surface for producing an electromotive force for dissipating heat, a first fan adapted to dissipate heat to the ambient, and a second fan adapted to draw external cold air into the cooling device, a method of cooling the CPU comprising the steps of: 
 a) defining an operating temperature of the CPU into one of a plurality of ranges;    b) setting a plurality of operations of the first fan, the second fan, and the thermal electric cooler based on each range wherein in a first range each of the thermal electric cooler, the first fan, and the second fan is off; in a second range each of the thermal electric cooler, the first fan, and the second fan is in a standby condition; In a third range the thermal electric cooler operates in low power, the first fan is on, and the second fan is off; in a fourth range the thermal electric cooler operates in high power, the first fan is on, and the second fan is off; in a fifth range the thermal electric cooler operates in high power, the first fan is on, and the second fan is on; in a sixth range the thermal electric cooler operates in full power, the first fan is on, and the second fan is on;    c) measuring the operating temperature of the CPU; and    d) running a control program to determine a corresponding one of the ranges that the cooling device is about to perform.    
   
   
       10 . In a chip-based cooling device mountable on a CPU arranged on a motherboard, the cooling device including a thermal electric cooler including a heat dissipating surface and a heat absorbing surface wherein electricity is produced by heating a junction between the heat absorbing surface and the heat dissipating surface for producing an electromotive force for dissipating heat, a first fan adapted to dissipate heat to the ambient, and a second fan adapted to draw external cold air into the cooling device, a method of cooling the CPU comprising the steps of: 
 a) defining an operating temperature of the CPU into one of a plurality of ranges;    b) setting a plurality of operations of the first fan, the second fan, and the thermal electric cooler based on each range wherein in a first range the thermal electric cooler operates in low power, the first fan is on, and the second fan is off; in a second range the thermal electric cooler operates in high power, the first fan is on, and the second fan is off; and in a third range the thermal electric cooler operates in high power, the first fan is on, and the second fan is on;    c) measuring the operating temperature of the CPU;    d) running a control program to determine a corresponding one of the ranges that the cooling device is about to perform; and    e) forming a cycle including the first, the second, and the third ranges such that a drop of the operating temperature of the CPU out of the third range is adapted to cause the cooling device to operate in the first range.    
   
   
       11 . In a chip-based cooling device mountable on a CPU arranged on a motherboard, a method of cooling the CPU comprising the steps of: 
 a) defining an operating temperature of the CPU into one of a plurality of ranges;    b) setting a plurality of operations of the first fan, the second fan, and the thermal electric cooler based on each range wherein in a first range the thermal electric cooler operates in low power, the first fan is on, and the second fan is off; in a second range the thermal electric cooler operates in high power, the first fan is on, and the second fan is off; in a third range the thermal electric cooler operates in high power, the first fan is on, and the second fan is on; and    in a fourth range the thermal electric cooler operates in full power, the first fan is on, and the second fan is on;    c) measuring the operating temperature of the CPU; and    d) running a control program to determine a corresponding one of the ranges that the cooling device is about to perform.    
   
   
       12 . In a chip-based cooling device mountable on a CPU arranged on a motherboard, a method of cooling the CPU comprising the steps of: 
 a) defining an operating temperature of the CPU into one of a plurality of ranges;    b) setting a plurality of operations of the first fan, the second fan, and the thermal electric cooler based on each range wherein in a first range the thermal electric cooler operates in low power, the first fan is on, and the second fan is off; in a second range the thermal electric cooler operates in high power, the first fan is on, and the second fan is off; and in a third range the thermal electric cooler operates in high power, the first fan is on, and the second fan is on;    c) measuring the operating temperature of the CPU;    d) running a control program to determine a corresponding one of the ranges that the cooling device is about to perform; and    e) forming a cycle including the first, the second, and the third ranges such that a drop of the operating temperature of the CPU out of the third range is adapted to cause the cooling device to operate in the first range.