Apparatus of clamping semiconductor devices using sliding finger supports

Abstract

An apparatus for supporting lead fingers during a wire bonding process and method of preventing the bonding apparatus and clamping assembly from applying force against the die. The present invention includes the use of a movable arm with a portion that is positionable under a portion of the lead fingers of a lead frame during the wire bonding process to provide increased stability of the lead fingers and prevent the bonding apparatus and clamping assembly from applying force against the die. The present invention also provides for the transfer of heat from the heat block directly to the lead fingers during the wire bonding process. The present invention includes the use of a clamp for stabilizing lead fingers during the wire bonding process.

1 . Apparatus for bonding a wire to a bond pad or the like located on a semiconductor device and a lead finger of a lead frame, the apparatus comprising: 
 bonding apparatus having a portion thereof for the dispensing of the wire to be bonded to the bond pad or the like and the lead finger and bonding the wire to the bond pad or the like or the lead finger;    an independent clamp for engaging another portion of the lead finger before the bonding of the wire thereto, the independent clamp being movable; and    a support arm for engaging an opposite surface of the lead frame, the support arm being positionable between the semiconductor device and the lead frame.    
   
   
       2 . Apparatus for bonding a wire to a bond pad located on a semiconductor chip and a lead finger of a lead frame, the apparatus comprising: 
 bonding apparatus having a portion thereof for the dispensing of the wire to be bonded to the bond pad and the lead finger and bonding the wire to the bond pad or the lead finger;    a penetrating clamp engaging another portion of the lead finger for the bonding of the wire thereto, the penetrating clamp penetrating a portion of the lead finger; and    a support arm for engaging an opposite surface of the lead frame, the support arm being positionable between the semiconductor die and the lead frame.    
   
   
       3 . Apparatus for bonding a wire to a bond pad or the like located on a semiconductor device and a lead finger of a lead frame, the apparatus comprising: 
 bonding apparatus having a portion thereof for the dispensing of the wire to be bonded to the bond pad or the like and the lead finger and bonding the wire to the bond pad or the like or the lead finger; and    a support arm for engaging an opposite surface of the lead frame, the support arm being positionable between the semiconductor device and the lead frame.    
   
   
       4 . The apparatus of  claim 3 , further comprising: 
 a clamp for engaging another portion of the lead finger before the bonding of the wire thereto, the clamp being movable.    
   
   
       5 . The apparatus of  claim 4 , wherein the clamp comprises an independent clamp.  
   
   
       6 . The apparatus of  claim 4 , further comprising: 
 a fixed clamp for engaging a portion of the lead finger.    
   
   
       7 . The apparatus of  claim 5 , wherein the independent clamp is located between the bonding apparatus and a fixed clamp engaging a portion of the lead finger during the bonding of the wire thereto.  
   
   
       8 . The apparatus of  claim 5 , wherein the independent clamp is movable independently in any direction of the movement of the bonding apparatus.  
   
   
       9 . The apparatus of  claim 3 , wherein the apparatus further comprises: 
 heating apparatus located beneath the semiconductor device.    
   
   
       10 . The apparatus of  claim 9 , wherein the apparatus further comprises: 
 heating apparatus located beneath the lead finger.    
   
   
       11 . The apparatus of  claim 5 , wherein the independent clamp is resiliently mounted.  
   
   
       12 . The apparatus of  claim 4 , wherein the clamp comprises: 
 a penetrating clamp engaging another portion of the lead finger for the bonding of the wire thereto, the penetrating clamp penetrating a portion of the lead finger.    
   
   
       13 . Method for supporting a portion of at least one lead finger of a lead frame during a portion of a wire bonding process for a semiconductor device, the method comprising the steps of: 
 positioning the lead frame in a wire bonding apparatus; and    moving an arm under a portion of the at least one lead finger of the lead frame.    
   
   
       14 . A method of clamping a portion of at least one lead finger of a lead frame and semiconductor device assembly during a wire bonding process, the method comprising the steps of: 
 providing a heater block;    disposing a lead frame and a semiconductor die over the heater block;    moving an arm under the portion of the at least one lead finger of the lead frame; and    clamping the portion of the at least one lead finger of the lead frame at a first location.    
   
   
       15 . A method of bonding a wire to a bond pad of a semiconductor device and lead finger of a lead frame, the method comprising the steps of: 
 positioning an arm under a portion of the lead finger; and    positioning an independent clamp over another portion of the lead finger during the bonding of the wire thereto.    
   
   
       16 . A method of bonding a wire to a bond pad of a semiconductor chip and lead finger of a lead frame, the method comprising the steps of: 
 positioning an arm under a portion of the lead finger; and    positioning a penetrating clamp over another portion of the lead finger during the bonding of the wire thereto.    
   
   
       17 . A method of transfer molding a plastic package about a semiconductor device assembly, the method of transfer molding comprising the steps of: 
 supporting at least a plurality of lead fingers of a lead frame during the wire bonding of the lead frame to a semiconductor device;    disposing the lead frame and the semiconductor device in a mold cavity;    introducing a softened molding compound into the mold cavity to form the plastic package; and    removing the plastic package from the mold cavity.