Electronic component package tape and method of manufacturing the same

Abstract

An electronic component package tape comprising a carrier tape of belt-like form storing electronic components in storage pockets formed into a concaved box shape at predetermined pitches, a cover tape of ribbon-like form bonded to the carrier tape to seal upper openings of the storage pockets, and first protrusions, each having a tip of rounded surface formed on an underside surface of the cover tape facing the electronic components. The storage pockets may be provided with a second protrusion formed in an upwardly protruding manner on a bottom surface thereof. In a method of manufacturing the electronic component package tape, the cover tape is held between a first and a second rotating bodies. Both of the rotating bodies are rotated to form protrusions on the cover tape, which is bonded to an upper surface of the carrier tape in a manner to cover openings of the storage pockets.

1 . An electronic component package tape comprising: 
 a carrier tape of belt-like form storing electronic components in a plurality of storage pockets formed into a concaved box shape at predetermined pitches;    a cover tape of ribbon-like form bonded to the carrier tape to seal upper openings of the storage pockets; and    first protrusions, each having a tip of rounded surface formed on an underside surface of the cover tape facing the electronic components.    
     
     
         2 . The electronic component package tape according to  claim 1 , wherein each of the storage pockets is provided with a second protrusion formed in an upwardly protruding manner on a bottom surface thereof.  
     
     
         3 . The electronic component package tape according to  claim 1 , wherein each of the storage pockets is provided with a recess formed in a bottom surface thereof.  
     
     
         4 . The electronic component package tape according to  claim 2 , wherein each of the storage pockets is provided with a recess formed in a bottom surface thereof.  
     
     
         5 . The electronic component package tape according to  claim 1 , wherein the cover tape has a thickness not smaller than 50 μm but not greater than 70 μm, the first protrusions have a height not smaller than 0.1 mm but not larger than 0.3 mm, and at least two of the first protrusions confront an upper surface of each of the electronic components.  
     
     
         6 . The electronic component package tape according to  claim 1 , wherein a ratio of a height of the first protrusions to a thickness of the cover tape is not smaller than 1.5 but not larger than 6.  
     
     
         7 . A method of manufacturing electronic component package tape comprising the steps of: 
 holding a cover tape of ribbon-like form between a first rotating body having a plurality of convex portions formed at predetermined pitches around the periphery thereof and a second rotating body having concave portions formed around the periphery thereof in locations corresponding to the convex portions;    forming protrusions of rounded surface on the cover tape by rotating the first rotating body and the second rotating body; and    bonding the cover tape formed with the protrusions to an upper surface of a carrier tape of belt-like form in a manner to cover openings of storage pockets formed in the carrier tape for carrying electronic components.