US2006157344A1PendingUtilityA1
Linear sweeping magnetron sputtering cathode and scanning in-line system for arc-free reactive deposition and high target utilization
Est. expirySep 19, 2023(expired)· nominal 20-yr term from priority
C23C 14/35H01J 37/3408H01J 37/3455
50
PatentIndex Score
0
Cited by
0
References
0
Claims
Abstract
A sweeping linear magnetron is described. The magnetron has a cathode backing plate, a drive housing attached to the cathode backing plate and a motor held in the drive housing. The motor drives a yoke positioned within a cut-out in the backing plate. The yoke has a magnet pack attached thereto said yoke such that the magnet pack is adapted to being moved over a target material and wherein the target material is being sputtered within a vacuum chamber onto a substrate.
Claims
exact text as granted — not AI-modified1 . A sweeping linear magnetron comprising a cathode backing plate, said cathode backing plate having an exterior surface adapted to be attached to a vacuum chamber wherein a plasma deposition process will occur; a drive housing attached to said exterior surface of said cathode backing plate, said drive housing positioned over a cut-out in the surface of said cathode backing plate; a motor held in said drive housing, said motor driving a yoke, said yoke positioned within said cut-out in said surface of said cathode backing plate; a magnet pack, said magnet pack attached to said yoke, said magnet pack having a first magnet mounting plate and a second magnet mounting plate that goes over the first magnet mounting plate and a plurality of magnets positioned between said first magnet mounting plate and said second magnet mounting plate, said magnet pack having between the first magnet mounting plate and the second magnet mounting plate one or more center magnets having a first end and a second end and a body between said first end and said second end and one or more side magnets having a first end and a second end and a body between said first end and said second end, the bodies of said center magnets and said side magnets generally positioned in the same alignment so that their ends do not contact each other and one or more end magnets one the magnet mounting plates in an area of the magnet mounting plates that extends past the ends of the center and side magnet; one or more filler magnets are positioned between the center magnets and the side magnets and said magnet pack being moved over a target material, said target material being sputtered within said vacuum chamber onto a substrate.
2 . The magnetron according to claim 1 wherein the magnet mounting plates have at least one side edge and at least one end edge, and said side magnets are positioned along said side edge and said end magnets are positioned along said end edge.
3 . (canceled)
4 . The magnetron according to claim 2 wherein one or more end magnets extend from one end of one side magnet to one end of a second side magnet.
5 . The magnetron according to claim 4 wherein one or more end magnets form an arc that extends from one end of one side magnet to one end of a second side magnet along the end edge of said magnet mounting plates.
6 - 10 . (canceled)
11 . The magnetron according to claim 1 wherein said magnet pack moves linearly across a width of said target material.
12 . The magnetron according to claim 1 wherein said magnet pack moves linearly across a length of said target material.
13 . The magnetron according to claim 1 wherein said motor is a frequency actuator.
14 . The magnetron according to claim 1 wherein said motor is an air cylinder.
15 . (canceled)
16 . (canceled)
17 . An improved magnetron comprising:
a cathode backing plate, said cathode backing plate attaching to a vacuum chamber wherein a plasma deposition process can occur; a magnet pack positioned within a cut-out in said cathode backing plate, said magnet pack adapted to move within said cut-out; a means to move said magnet pack within said cut-out; and a target material, said target material being on a side of said cathode backing plate in said vacuum chamber, said magnet pack moving over said target material to alter a magnetic field created by said magnet pack, said magnetic pack having one or more center magnets and one or more side magnets, and wherein one or more filler magnets are positioned between the center magnets and the side magnets.
18 . A magnet pack for use in a plasma deposition process comprising:
a first magnet mounting plate; a second magnet mounting plate that goes over the first magnet mounting plate; and a plurality of magnets positioned between said first magnet mounting plate and said second magnet mounting plate, said magnet pack having between the first magnet mounting plate and the second magnet mounting plate one or more center magnets having a first end and a second end and a body between said first end and said second end and one or more side magnets having a first end and a second end and a body between said first end and said second end, the bodies of said center magnets and said side magnets generally positioned in the same alignment so that their ends do not contact each other and one or more end magnets one the magnet mounting plates in an area of the magnet mounting plates that extends past the ends of the center and side magnet.
19 . A target material uniformly eroded by a device, said device comprising
a cathode backing plate, said cathode backing plate having an exterior surface adapted to be attached to a vacuum chamber wherein a plasma deposition process will occur; a drive housing attached to said exterior surface of said cathode backing plate, said drive housing positioned over a cut-out in the surface of said cathode backing plate; a motor held in said drive housing, said motor driving a yoke, said yoke positioned within said cut-out in said surface of said cathode backing plate; a magnet pack, said magnet pack attached to said yoke, said magnet pack having a first magnet mounting plate and a second magnet mounting plate that goes over the first magnet mounting plate and a plurality of magnets positioned between said first magnet mounting plate and said second magnet mounting plate, said magnet pack having between the first magnet mounting plate and the second magnet mounting plate one or more center magnets having a first end and a second end and a body between said first end and said second end and one or more side magnets having a first end and a second end and a body between said first end and said second end, the bodies of said center magnets and said side magnets generally positioned in the same alignment so that their ends do not contact each other and one or more end magnets one the magnet mounting plates in an area of the magnet mounting plates that extends past the ends of the center and side magnet; and said magnet pack being moved over a target material, said target material being sputtered within said vacuum chamber onto a substrate.
20 - 31 . (canceled)
32 . A film formed by a sweeping linear magnetron said magnetron comprising
a cathode backing plate, said cathode backing plate having an exterior surface adapted to be attached to a vacuum chamber wherein a plasma deposition process will occur; a drive housing attached to said exterior surface of said cathode backing plate, said drive housing positioned over a cut-out in the surface of said cathode backing plate; a motor held in said drive housing, said motor driving a yoke, said yoke positioned within said cut-out in said surface of said cathode backing plate; a magnet pack, said magnet pack attached to said yoke, said magnet pack having a first magnet mounting plate and a second magnet mounting plate that goes over the first magnet mounting plate and a plurality of magnets positioned between said first magnet mounting plate and said second magnet mounting plate, said magnet pack having between the first magnet mounting plate and the second magnet mounting plate one or more center magnets having a first end and a second end and a body between said first end and said second end and one or more side magnets having a first end and a second end and a body between said first end and said second end, the bodies of said center magnets and said side magnets generally positioned in the same alignment so that their ends do not contact each other and one or more end magnets one the magnet mounting plates in an area of the magnet mounting plates that extends past the ends of the center and side magnet; and said magnet pack being moved over a target material, said target material being sputtered within said vacuum chamber onto a substrate.Join the waitlist — get patent alerts
Track US2006157344A1 — get alerts on status changes and closely related new filings.
We store only your email — no account needed. See our privacy policy.