Platen assembly utilizing magnetic slip ring

Abstract

Embodiments of the present invention generally relate to an apparatus for processing a substrate and more specifically to a device that will transfer electrical power and/or control signals between a stationary base and a rotating platen without involving mechanical contact. The device does not suffer the drawbacks of conventional slip rings burdened with moving surfaces. In one embodiment, an apparatus for processing a substrate is provided. The apparatus includes a platen assembly having a surface for supporting a planarizing material and disposed on a stationary base so that the platen assembly may rotate relative to the base. The apparatus further includes a coupling assembly for transferring electrical energy from a primary coil to a secondary coil. The coupling assembly includes the primary coil of wire wrapped around a first core; the first core coupled to the base; the secondary coil of wire wrapped around a second core; and the second core coupled to the platen assembly.

1 . An apparatus for processing a substrate, comprising: 
 a platen assembly having a surface for supporting a planarizing material and disposed on a stationary base so that the platen assembly may rotate relative to the base; and    a coupling assembly for transferring electrical energy from a primary coil to a secondary coil, comprising: 
 the primary coil of wire wrapped around a first core;  
 the first core coupled to the base;  
 the secondary coil of wire wrapped around a second core; and  
 the second core coupled to the platen assembly.  
   
   
   
       2 . The apparatus of  claim 1 , wherein the coupling assembly further comprises: 
 an IR transmitter and receiver coupled to the base; and    an IR transmitter and receiver coupled to the platen assembly.    
   
   
       3 . The apparatus of  claim 1 , wherein the first core is substantially longitudinally aligned with the second core.  
   
   
       4 . The apparatus of  claim 1 , further comprising: 
 a plenum defined within the platen assembly; and    a plurality of passages formed through the platen assembly coupling the support surface to the plenum.    
   
   
       5 . The apparatus of  claim 4 , wherein the platen assembly further comprises a top plate that includes the top surface and having at least a first portion of each of the passages formed therethrough.  
   
   
       6 . The apparatus of  claim 5 , wherein the platen assembly further comprises 
 a conductive contact plate disposed opposite a surface of the top plate having the processing pad disposed thereon and electrically coupled to the conductive elements, the conductive contact plate having at least a second portion of each of the passages formed therethrough.    
   
   
       7 . The apparatus of  claim 4 , further comprising an electrode disposed on the platen assembly.  
   
   
       8 . The apparatus of  claim 1 , further comprising: 
 a processing pad disposed on the platen assembly and having an upper dielectric processing surface adapted to process the substrate thereon; and    one or more conductive elements arranged on the upper processing surface to electrically bias the substrate.    
   
   
       9 . An apparatus for processing a substrate, comprising: 
 a platen assembly having a surface for supporting a planarizing material and disposed on a stationary base so that the platen assembly may rotate relative to the base; and    means for transferring electrical energy from the base to the platen assembly.    
   
   
       10 . The apparatus of  claim 9 , further comprising means for transferring data between the base and the platen assembly.