System and method for filling openings in semiconductor products

Abstract

Explosive forces are used to fill interconnect material into trenches, via holes and other openings in semiconductor products. The interconnect material may be formed of metal. The metal may be heated prior to the force filling step. The explosive forces may be generated, for example, by igniting mixtures of gases such as hydrogen and oxygen, or liquids such as alcohol and hydrogen peroxide. To control or buffer the explosive force, a baffle may be interposed between the explosions and the products being processed. The baffle may be formed of a porous material to transmit waves to the semiconductor products while protecting the products from contaminants. Various operating parameters, including the flow rate of the fuel and the oxidizing materials, may be positively controlled. In another embodiment of the invention, a piston is used to transmit the explosive force. If desired, an annular space at the periphery of the piston may be maintained at atmospheric pressure to protect against wafer contamination. A compact apparatus for filling holes in semiconductor wafers is also disclosed.

1 .- 38 . (canceled)  
   
   
       39 . A method of processing a semiconductor product, said method comprising the steps of: 
 flowing a liquid fuel into a reaction chamber;    flowing an oxidizer into said reaction chamber at high pressure; and    initiating an explosion to move a first piston toward said semiconductor product.    
   
   
       40 . The method of  claim 39 , further comprising the step of pressurizing said oxidizer between two one-way valves.  
   
   
       41 . The method of  claim 39 , further comprising the step of using a second piston to pressurize said oxidizer, said second piston being operatively connected to said first piston.  
   
   
       42 . The method of  claim 41 , further comprising the step of using a metering orifice to control the flow of said oxidizer, said metering orifice being located between said first and second pistons.  
   
   
       43 . The method of  claim 39 , further comprising the step of using a pressure accumulator to pressurize said oxidizer, said pressure accumulator being operatively connected to opposite sides of said first piston.