Composition for preparing organic insulator

Abstract

Disclosed is a composition for preparing an organic insulator, the composition comprising (i) at least one organic-inorganic hybrid material; (ii) at least one organometallic compound and/or organic polymer; and (iii) at least one solvent for dissolving the above two components, so that an organic insulator using the same has a low threshold voltage and driving voltage, and high charge carrier mobility and I on /I off ratio, thereby enhancing insulator characteristics. Further, the preparation of organic insulating film can be carried out by wet process, so that simplification of the process and cut of cost are achieved.

1 . A composition for preparing organic insulators comprising (i) at least one organic-inorganic hybrid material; (ii) at least one organometallic compound and/or organic polymer; (iii) and at least one solvent for dissolving the components (i) and (ii).  
   
   
       2 . The composition according to  claim 1 , wherein the organic-inorganic hybrid material is an organosilane compound or a polymer formed by hydrolyzing and polycondensing the organosilane compound in the presence of an acid or alkaline catalyst.  
   
   
       3 . The composition according to  claim 2 , wherein the organosilane compound is selected from the group consisting of compounds represented by Formulas 1 to 3:  
       SiX 1 X 2 X 3 X 4   Formula 1  R 1 R 2 SiX 1 X 2 X 3   Formula 2  R 1 R 2 SiX 1 X 2   Formula 3  wherein, R 1  and R 2  are each independently hydrogen atom, C 1-10  alkyl group, C 3-10  cycloalkyl group, C 6-15  aryl group, C 2-30  acryl group or epoxy group-containing alkyl, cycloalkyl or aryl group; and    X 1 , X 2 , X 3  and X 4  are each independently halogen atom, or C 1-5  alkoxy group.    
   
   
       4 . The composition according to  claim 1 , wherein the organometallic compound is selected from the group consisting of titanium based compounds, zirconium based compounds, hafnium based compound, and aluminium based compound.  
   
   
       5 . The composition according to  claim 4 , wherein the organometallic compound is selected from a group consisting of titanium(IV) n-butoxide, titanium(IV) t-butoxide, titanium(IV) ethoxide, titanium(IV) 2-ethylhexoxide, titanium(IV) iso-propoxide, titanium(IV) (di-iso-propoxide) bis(acetylacetonate), titanium(IV) oxide bis(acetylacetonate), trichlorotris(tetrahydrofuran)titanium(III), tris(2,2,6,6-tetramethyl-3,5-heptanedionato)titanium(III), (trimethyl) pentamethyl cyclopentadienyl titanium(IV), pentamethylcyclopentadienyltitanium trichloride(IV), pentamethylcyclo-pentadienyltitanium trimethoxide(IV), tetrachlorobis(cyclohexylmercapto) titanium(IV), tetrachlorobis(tetrahydrofuran)titanium(IV), tetrachlorodiaminetitanium(IV), tetrakis(diethylamino)titanium(IV)], tetrakis(dimethylamino)titanium(IV), bis(t-butylcyclopentadienyl)titanium dichloride, bis(cyclopentadienyl) dicarbonyl titanium(II), bis(cyclopentadienyl)titanium dichloride, bis(ethylcyclopentadienyl)titanium dichloride, bis(pentamethylcyclopentadienyl)titanium dichloride, bis(iso-propylcyclopentadienyl)titanium dichloride], tris(2,2,6,6-tetramethyl-3,5-heptanedionato)oxotitanium(IV), chlorotitanium triisopropoxide, cyclopentadienyltitanium trichloride], dichlorobis(2,2,6,6-tetramethyl-3,5-heptanedionato)titanium(IV), dimethylbis(t-butylcyclopentadienyl)titanium(IV), di(iso-propoxide)bis(2,2,6,6-tetramethyl-3,5-heptanedionato)titanium(IV), zirconium(IV) n-butoxide, zirconium(IV) t-butoxide, zirconium(IV) ethoxide, zirconium(IV) iso-propoxide, zirconium(IV) n-propoxide, zirconium(IV) acetylacetonate, zirconium(IV) hexafluoroacetylacetonate, zirconium (IV) trifluoroacetylacetonate, tetrakis(diethylamino)zirconium, tetrakis(dimethylamino)zirconium, tetrakis(2,2,6,6-tetramethyl-3,5-heptanedionato)zirconium(IV), zirconium(IV) sulfate tetrahydrate, hafnium(IV) n-butoxide, hafnium(IV) t-butoxide, hafnium(IV) ethoxide, hafnium(IV) iso-propoxide, hafnium(IV) iso-propoxide monoisopropylate, hafnium(IV) acetylacetonate, tetrakis(dimethylamino)hafnium, aluminium n-butoxide, aluminium t-butoxide, aluminium s-butoxide, aluminium ethoxide, aluminium iso-propoxide, aluminium acetylacetonate, aluminium hexafluoroacetylacetonate, aluminium trifluoroacetylacetonate and tris(2,2,6,6-tetramethyl-3,5-heptanedionato)aluminium.  
   
   
       6 . The composition according to  claim 1 , wherein the ratio of the organometallic compound is 1-300 parts by weight based on 100 parts by weight of the organic-inorganic hybrid material.  
   
   
       7 . The composition according to  claim 1 , wherein the organic polymer is selected from a group consisting of polyesters, polycarbonates, polyvinylalcohols, polyvinylbutyrals, polyacetals, polyarylates, polyamides, polyamidimides, polyetherimides, polyphenylenethers, polyphenylenesulfides, polyethersulfones, polyetherketones, polyphthalamides, polyethernitriles, polyethersulfones, polybenzimidazoles, polycarbodiimides, polysiloxanes, polymethylmethacrylates, polymethacrylamides, nitrile rubbers, acryl rubbers, polyethylenetetrafluorides, epoxy resins, phenol resins, melamine resins, urea resins, polybutenes, polypentenes, poly(ethylene-co-propylene), poly(ethylene-co-butenediene), polybutadienes, polyisoprenes, poly(ethylene-co-propylene diene), butyl rubbers, polymethylpentenes, polystyrenes, poly(styrene-co-butadiene), hydrogenated poly(styrene-co-butadiene), hydrogenated polyisoprenes, and hydrogenated polybutadienes.  
   
   
       8 . The composition according to  claim 1 , wherein the ratio of the organic polymer is 0.01-50 parts by weight based on 100 parts by weight parts of the organic-inorganic hybrid material.  
   
   
       9 . The composition according to  claim 1 , wherein the solvent is selected from a group consisting of aliphatic hydrocarbon; aromatic hydrocarbon solvents; ketone-based solvents; ether-based solvents; acetate-based solvents; alcohol-based solvents; amide-based solvents; silicon-based solvents; and a mixture thereof.  
   
   
       10 . The composition according to  claim 1 , wherein the content of the organic solvent in the composition is 20-99.9 wt %.  
   
   
       11 . A method of preparing an organic insulator, which comprises: 
 coating a substrate with the composition according to  claim 1  to form an insulating film; and    curing the insulating film.    
   
   
       12 . The method according to  claim 11 , wherein the insulating film is coated by spin-coating, dip-coating, printing, spray-coating, or roll-coating.  
   
   
       13 . The method according to  claim 11 , wherein the insulating film is cured at 70-150□ for 0.5-2 hrs.  
   
   
       14 . An organic insulator prepared by the method according to  claim 11 .  
   
   
       15 . An organic thin film transistor comprising a substrate; a gate electrode; an insulating film; an organic active layer; and source-drain electrodes, wherein the insulating film is the organic insulator according to  claim 14.