Substrate processing apparatus, method of controlling substrate, and exposure apparatus

Abstract

A load-lock apparatus including a load-lock chamber, a chuck, arranged in the load-lock chamber, to hold a substrate, a pressure reduction system to reduce a pressure in the load-lock chamber using an exhaust valve, a pressure measurement system to measure a pressure in the load-lock chamber, and a time measurement system to measure an operating time of the pressure reduction system. The exhaust valve is controlled such that a relationship between a pressure measured by the pressure measurement system and a time measured by the time measurement system falls within a predetermined range with respect to a predetermined relationship.

1 - 19 . (canceled)  
   
   
       20 . A load-lock apparatus comprising: 
 a load-lock chamber;    a chuck, arranged in said load-lock chamber, to hold a substrate;    a pressure reduction system to reduce a pressure in said load-lock chamber using an exhaust valve;    a pressure measurement system to measure a pressure in said load-lock chamber; and    a time measurement system to measure an operating time of said pressure reduction system,    wherein said exhaust valve is controlled such that a relationship between a pressure measured by said pressure measurement system and a time measured by said time measurement system falls within a predetermined range with respect to a predetermined relationship.