Multilayer film and process for producing the same
Abstract
The present invention is aimed at providing a multilayer film having high quality and high processability which can be safely and stably produced. Such object of the present invention can be achieved by a multilayer film comprising a base material, a polymer resin layer and a metal deposited layer and/or a metal oxide deposited layer provided thereon, wherein the polymer resin layer contains a polymer produced by polymerization of an unsaturated compound having two or more ethylenic bonds and/or acetylenic bonds in one molecule and having neither acrylic group nor methacrylic group, in an amount of 80% by weight or more based on the polymer resin layer. The multilayer film according to the present invention can be used for a metallized packaging film having gas barrier properties or a metallized film for a capacitor and the like.
Claims
exact text as granted — not AI-modified1 - 20 . (canceled)
21 . A multilayer film comprising a polymeric base material that is selected from the group consisting essentially of polyolefin and/or polyester, a polymer resin layer and a metal deposited layer and/or a metal oxide deposited layer that is selected from the group consisting of aluminum, aluminum oxide, and aluminum based alloy, provided on the polymeric base material, wherein said polymer resin layer comprises a polymer produced by polymerization of an unsaturated compound having (a) two or more ethylenic bonds and/or (b) two or more acetylenic bonds in one molecule and having neither an acrylic group nor a methacrylic group, said polymer being present in said polymer resin layer in an amount of 80% by weight or more based on said polymer resin layer, wherein the thickness of said polymer resin layer is not less than 0.02 μm and not more than 1 μm, and wherein said unsaturated compound is one or more compounds selected from the group consisting of an unsaturated fatty acid, an unsaturated fatty ester, and a terpene having an unsaturated bond.
22 . A multilayer film according to claim 21 , wherein the polymer resin layer is provided on the polymeric base material and the metal deposited layer and/or the metal oxide deposited layer is provided on the polymer resin layer.
23 . A multilayer film according to claim 21 , wherein the metal deposited layer and/or the metal oxide deposited layer is provided on the polymeric base material and the polymer resin layer is provided on the metal deposited layer and/or the metal oxide deposited layer.
24 . A multilayer film according to claim 21 , wherein the thickness of the polymer resin layer is not less than 0.05 μm and not more than 0.5 μm.
25 . A multilayer film according to claim 21 , wherein the unsaturated fatty acid, unsaturated fatty ester, and terpene having an unsaturated bond are compounds isolated from natural substances.
26 . A multilayer film according to claim 25 , wherein the unsaturated fatty acid, unsaturated fatty ester, and terpene having an unsaturated bond are compounds selected from the group consisting of a drying oil, a semi-drying oil, or a hydrolysate thereof, or a part of the component thereof, or a combination thereof.
27 . A multilayer film according to claim 26 , wherein the drying oil or the semi-drying oil is a compound having an iodine value of not less than 100.
28 . A multilayer film according to claim 21 , wherein the unsaturated fatty acid, unsaturated fatty ester, and terpene having an unsaturated bond are one or more compounds selected from the group consisting of coconut oil, soybean oil, linseed oil, palm kernel oil, safflower oil, china wood oil, tall oil, linolic acid, linolenic acid, ricinoleic acid, eleostearic acid, triglyceride linoleate, triglyceride linolenate, citral, citronellal, citronellol, nerolidol, geraniol, milsen, linalool, and limonene.
29 . A multilayer film according to claim 21 , said multilayer film having a property of a metallized packaging film or a metallized film for a capacitor.
30 . A process for producing a multilayer film, comprising forming a polymer resin layer on a base material and depositing a metal layer and/or a metal oxide layer on the base material, wherein said forming a polymer resin layer comprises depositing an unsaturated compound having two or more ethylenic bonds and/or acetylenic bonds in one molecule and having neither acrylic group nor methacrylic group on the base material, and then irradiating the unsaturated compound with energy rays.
31 . A process for producing a multilayer film according to claim 30 , wherein the metal and/or the metal oxide is deposited on the base material and then said unsaturated compound is deposited on said metal layer and/or metal oxide layer.
32 . A process for producing a multilayer film according to claim 30 , wherein said unsaturated compound is deposited on the base material and irradiated with energy rays to form the polymer resin layer, and then the metal and/or metal oxide is deposited on said polymer resin layer.
33 . A process for producing a multilayer film according to claim 30 , wherein a surface of the base material is subjected to a plasma treatment prior to said forming a polymer resin layer and depositing a metal layer and/or a metal oxide layer.
34 . A process for producing a multilayer film according to claim 30 , wherein the energy rays are selected from the group consisting of ultraviolet rays, ions, excited atoms, and excited molecules.
35 . A process for producing a multilayer film according to claim 30 , wherein the energy rays are a plasma of a gas containing oxygen atoms.
36 . A process for producing a multilayer film according to claim 30 , wherein the depositing the unsaturated compound on the base material comprises atomizing the unsaturated compound to form atomized particles and impinging said atomized particles on a wall of a heated apparatus.
37 . A process for producing a multilayer film according to claim 36 , wherein the unsaturated compound is atomized by applying an electric voltage to the unsaturated compound.
38 . A process for producing a multilayer film according to claim 36 , wherein a wall of said heated apparatus comprises an aperture, wherein the unsaturated compound is deposited while an electric voltage is applied between the aperture and the metal layer and/or metal oxide layer.
39 . A process for producing a multilayer film according to claim 30 , wherein said forming a polymer resin layer and depositing a metal layer and/or a metal oxide layer on a base material is in vacuum.
40 . A multilayer film comprising a polymeric base material that is selected from the group consisting essentially of polyolefin and/or polyester, a polymer resin layer and a metal layer and/or metal oxide layer that is selected from the group consisting of aluminum, aluminum oxide, and aluminum based alloy, provided on the polymeric base material, wherein said polymer resin layer comprising a polymer produced by polymerization of an unsaturated compound having (a) two or more ethylenic bonds and/or (b) two or more acetylenic bonds in one molecule and having neither an acrylic group nor a methacrylic group, said polymer being present in said polymer resin layer in an amount of 80% by weight or more based on said polymer resin layer, and wherein the thickness of said polymer resin layer is not less than 0.02 μm and not more than 1 μm, and wherein said unsaturated compound is one or more compounds selected from the group consisting of an unsaturated fatty acid, an unsaturated fatty ester, and a terpene having an unsaturated bond.Join the waitlist — get patent alerts
Track US2006141244A1 — get alerts on status changes and closely related new filings.
We store only your email — no account needed. See our privacy policy.