Connection arrangement for optical communication systems

Abstract

An arrangement including: an electrical subassembly, an optical subassembly, the electrical subassembly and the optical subassembly having an associated electrical connection including at least one electrical lead extending therebetween, and an electrically non-conductive electromagnetic absorber body arranged to at least partly cover the electrical lead.

1 - 9 . (canceled)  
   
   
       10 . An arrangement including: 
 a support board of a dielectric material,    at least one electrically conductive lead for conveying RF signals over said support board, and    at least one electrically non-conductive electromagnetic absorber body arranged to at least partly cover said at least one electrical lead.    
   
   
       11 . The arrangement of  claim 10 , including a plurality of said electrical leads in a frame, said at least one absorber body arranged to extend over said lead frame.  
   
   
       12 . The arrangement of  claim 10 , wherein said at least one electrical lead is arranged between said absorber body and said support board.  
   
   
       13 . The arrangement of  claim 12 , including at least one further electrically non-conductive electromagnetic absorber body associated with said support board, wherein said at least one electrical lead is sandwiched between said at least one absorber body and said at least one further absorber body.  
   
   
       14 . The arrangement of  claim 10 , wherein said electrical lead is a radio frequency electrical connection.  
   
   
       15 . The arrangement of  claim 10 , wherein said absorber body is selected out of the group consisting of magnetically loaded, iron loaded, ferrite loaded or dielectrically loaded materials.  
   
   
       16 . The arrangement of  claim 10 , wherein said absorber body is comprised of a material selected from the group consisting of silicon, urethane, vinyl plastic and silicon rubber.  
   
   
       17 . The arrangement of  claim 10 , wherein said absorber body is in the form of a sheet material.  
   
   
       18 . An arrangement including: 
 a support board of a dielectric material,    at least one electrically conductive lead for conveying RF signals over said support board, and    at least one electrically non-conductive electromagnetic absorber body arranged to at least partly cover said at least one electrical lead.    
   
   
       19 . A casing for communication apparatus, said apparatus including at least one electrical lead for carrying RF signals within the apparatus, the casing including at least one electrically non-conductive electromagnetic absorber body arranged to at least partly cover said electrical lead.  
   
   
       20 . The casing of  claim 19 , having associated a dielectric support board for said at least one electrical lead, wherein said at least one lead is adapted to arranged between said absorber body and said support board.  
   
   
       21 . The casing of  claim 19 , wherein said absorber body is selected out of the group consisting of magnetically loaded, iron loaded, ferrite loaded or dielectrically loaded materials.  
   
   
       22 . The casing of  claim 19 , wherein said absorber body is comprised of a material selected from the group consisting of silicon, urethane, vinyl plastic and silicon rubber.  
   
   
       23 . The casing of  claim 19 , wherein said absorber body is in the form of a sheet material.  
   
   
       24 . An arrangement including: 
 a supporting board of dielectric material,    at least one electrically conductive lead for conveying RF signals over said board, and    at least one electrically non-conductive electromagnetic absorber body arranged to at least partly cover said at least one electrical lead.