Fan control system and method and heat dissipation system of electronic equipment
Abstract
A fan control system having a temperature sensor, a temperature control module, a first logic, a second logic and a fan control circuit is provided to resolve the heat problem and the noise problem. The temperature sensor is used to detect the operation temperature of an integrated circuit, and the temperature control module receives the detected temperature to output a first logic signal. According to the first logic signal, the first logic outputs a second logic signal. One or more than one operation relationship between the fan rotation speed and operation temperature is set up in the second logic. According to the second logic signal, a curve showing the relationship between the fan rotation speed and the operation temperature is selected, and a second control signal is output. The control circuit can thus output a voltage to make the fan rotating, in responding to the second control signal.
Claims
exact text as granted — not AI-modified1 . A fan control system for an electronic apparatus that includes one or at least one integrated circuits, the system comprising:
at least one temperature sensor arranged correspondingly to some or all of the integrated circuits, for detecting operation temperature of the corresponding integrated circuits; a temperature control module connected to the temperature sensors, the temperature control module being operative to output a first logic signal corresponding to the detected temperature, and a first control signal corresponding to the electronic apparatus; a first logic connected to the temperature control module, the first logic being operative to output a second logic signal corresponding to the first control signal; a second logic connected to the first logic, including at least one fan rotation speed-operation temperature relationship stored therein, the second logic being operative to output a second control signal based on the corresponding fan rotation speed-operation temperature relationship; and at least one control circuit to receive the second control signal and provide a voltage corresponding to the second control signal.
2 . The system of claim 1 , wherein the temperature control module and the first logic are arranged on a motherboard, and the second logic and the control circuit are arranged in a power supply of the electronic apparatus.
3 . The system of claim 1 , wherein the temperature control module comprises a super input/output chip.
4 . The system of claim 1 , wherein the temperature control module comprises a super input/output chip and at least one thermal control integrated circuit operative to receive the temperature detected by the temperature sensors.
5 . The system of claim 1 , wherein the temperature control module comprises at least one thermal control integrated circuit operative to receive the temperature detected by the temperature sensors.
6 . The system of claim 1 , wherein the bit number of the first logic signal corresponds to the number of the temperature sensors.
7 . The system of claim 1 , wherein the first and second logics are independent electronic or integrated circuits.
8 . The system of claim 1 , wherein the first and second logics are integrated into a single electronic or integrated circuit.
9 . The system of claim 1 , wherein the second logic and the control circuit are independent electronic or integrated circuits.
10 . The system of claim 1 , wherein the second logic and the control circuit are integrated into a single electronic or integrated circuit.
11 . A heat dissipation system of an electronic apparatus having one or at least one integrated circuits, comprising:
at least one temperature sensor arranged correspondingly to some or all of the integrated circuits, for detecting the operation temperature of the corresponding integrated circuits; a temperature control module in communication with the temperature sensor to output a first logic signal corresponding to the detected temperature and a first control signal corresponding to operation status of the electronic apparatus; a first logic in communication with the temperature control module to output a second logic signal corresponding to the first logic signal and the first control signal; a second logic in communication with the first logic, the second logic including at least one relationship of fan rotation speed and operation temperature and being operative to output a second control signal according to the relationship of fan rotation speed and operation temperature corresponding to the first logic signal and the first control signal; at least one control circuit to receive the second control signal and to output a voltage corresponding to the second control signal; and at least one fan, each connected to the corresponding control circuit, driven to rotate by the corresponding voltage.
12 . The system of claim 11 , wherein the temperature control module and the first logic are arranged on a motherboard of the electronic apparatus, and the second logic and the control circuit are arranged in a power supply of the electronic apparatus.
13 . The system of claim 11 , wherein the fan is arranged in a power supply of the electronic apparatus which provides power to the fan.
14 . The system of claim 11 , wherein the fans selectively arranged correspondingly to some or all of the integrated circuits, and a motherboard of the electronic apparatus provides power to the fans.
15 . The system of claim 11 , wherein the temperature control module comprises a super input/output chip.
16 . The system of claim 11 , wherein the temperature control module comprises a super input/output chip and a thermal control integrated circuit operative to receive the detected temperature.
17 . The system of claim 11 , wherein the bit number of the first logic signal corresponds to the number of the temperature sensors.
18 . The system of claim 11 , wherein the first logic and the second logic are independent electronic or integrated circuits.
19 . The system of claim 11 , wherein the first and second logics are integrated into a signal electronic or integrated circuit.
20 . The system of claim 11 , wherein the second logic and the control circuit are independent electronic or integrated circuits.
21 . The system of claim 11 , wherein the second logic and the control circuit are integrated into the same electronic or integrated circuit.
22 . A fan control method for an electronic apparatus that has at least one integrated circuit, the method comprising:
detecting the operation temperature of the at least one integrated circuit; generating a first logic signal according to the operation temperature and a first control signal according to operation status of the integrated circuit; generating a second logic signal according to the first logic signal and the first control signal; selecting a relationship between fan rotation speed and temperature according to the second logic signal and generating a second control signal by the relationship; and outputting a voltage according to the second control signal to drive a fan to rotate.Join the waitlist — get patent alerts
Track US2006138247A1 — get alerts on status changes and closely related new filings.
We store only your email — no account needed. See our privacy policy.