US2006137773A1PendingUtilityA1
Copper alloy having bendability and stress relaxation property
Est. expiryDec 24, 2024(expired)· nominal 20-yr term from priority
C22C 9/00H05K 1/09
47
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Claims
Abstract
A copper alloy contains 0.01% to 1.0% of Fe, 0.01% to 0.4% of P, and 0.1% to 1.0% of Mg with the remainder being copper and inevitable impurities and has a volume fraction of dispersoids having a particle diameter exceeding 200 nm of 5% or less, in which dispersoids having a particle diameter of 200 nm or less and containing Mg and P have an average particle diameter of 5 nm or more and 50 nm or less. The copper alloy preferably has an average particle diameter of dispersoids containing Fe and P of 20 nm or less. The copper alloy has improved bendability and stress relaxation property.
Claims
exact text as granted — not AI-modified1 . A copper alloy having bendability and stress relaxation property and comprising 0.01 to 1.0 percent by mass of Fe, 0.01 to 0.4 percent by mass of P, and 0.1 to 1.0 percent by mass of Mg, with the remainder being copper and inevitable impurities, wherein the copper alloy has a volume fraction of dispersoids each having a particle diameter exceeding 200 nm of 5% or less, and wherein dispersoids each having a particle diameter of 200 nm or less and containing Mg and P have an average particle diameter of 5 nm or more and 50 nm or less.
2 . The copper alloy according to Claim 1 , wherein dispersoids each having a particle diameter of 200 nm or less and containing Fe and P have an average particle diameter of 1 nm or more and 20 nm or less.
3 . The copper alloyaccording to one of claims 1 and 2 , further comprising 0.01 to 1.0 percent by mass of at least one of Ni and Co.
4 . The copper alloy according to any one of claims 1 to 3 , further comprising 0.005 to 3.0 percent by mass of Zn.
5 . The copper alloy according to any one of claims 1 to 4 , further comprising 0.01 to 5.0 percent by mass of Sn.
6 . The copper alloy according to any one of claims 1 to 5 , wherein the copper alloy has a total content of Mn, Ca, Zr, Ag, Cr, Cd, Be, Ti, Co, Ni, Au, and Pt of 1.0 percent by mass or less.
7 . The copper alloy according to any one of claims 1 to 6 , wherein the copper alloy has a total content of Hf, Th, Li, Na, K, Sr, Pd, W, S, Si, C, Nb, Al, V, Y, Mo, Pb, In, Ga, Ge, As, Sb, Bi, Te, B, and misch metals of 0.1 percent by mass or less.Join the waitlist — get patent alerts
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