Ball limiting metallurgy split into segments

Abstract

The present invention discloses a novel layout and process for a device with segmented BLM for the I/Os. In a first embodiment, each BLM is split into two segments. The segments are close to each other and connected to the same overlying bump. In a second embodiment, each BLM is split into more than two segments. In a third embodiment, each segment is electrically connected to more than one underlying via. In a fourth embodiment, each segment is electrically connected to more than one underlying bond pad.

1 .- 25 . (canceled)  
   
   
       26 . A device having I/O connections to a package or board comprising: 
 a bond pad, said bond pad having two or more segments, and    a wire lead attached to said segments.    
   
   
       27 . The device of  claim 26  further comprising underlying vias, wherein each of said segments is electrically connected to two or more of said underlying vias.  
   
   
       28 . The device of  claim 26  further comprising underlying lines, wherein each of said segments is electrically connected to two or more of said underlying lines.  
   
   
       29 . A device having input/output connections comprising: 
 a bond pad, said bond pad split into two or more segments;    a passivation layer disposed over said segments;    two or more vias disposed in said passivation layer to uncover each of said segments; and    a wire lead disposed in said vias and over said segments.    
   
   
       30 . The device of  claim 29  wherein said segments are laterally offset from a center of said wire lead.  
   
   
       31 . The device of  claim 29  wherein said segments comprise a polygonal layout.  
   
   
       32 . The device of  claim 29  wherein said vias are laterally offset from a center of said wire lead.  
   
   
       32 . The device of  claim 29  wherein said vias comprise a polygonal layout.