Polishing apparatus

Abstract

A polishing apparatus according to the present invention has a polishing surface ( 101 ), a top ring ( 1 ) for holding a semiconductor wafer (W), and a top ring shaft ( 11 ) for pressing the top ring ( 1 ) against the polishing surface ( 101 ). The top ring ( 1 ) has a retainer ring ( 3 ) for holding a peripheral portion of the semiconductor wafer (W), a housing ( 2 ) substantially in a form of a disk which is connected to the top ring shaft ( 11 ), a sliding contact joint ( 4, 5, 6, 2 b ) interconnecting the retainer ring ( 3 ) and the housing ( 2 ) in a state such that the retainer ring ( 3 ) and the housing ( 2 ) are brought into sliding contact with each other.

1 . A polishing apparatus comprising: 
 a polishing surface;    a top ring for holding a workpiece to be polished; and    a top ring shaft for pressing said top ring against said polishing surface, said top ring including: 
 a retainer ring for holding a peripheral edge portion of the workpiece,  
 a housing substantially in a form of a disk, said housing being connected to said top ring shaft, and  
 a sliding contact joint interconnecting said retainer ring and said housing in a state such that said retainer ring and said housing are brought into sliding contact with each other.  
   
     
     
         2 . The polishing apparatus as recited in  claim 1 , wherein said sliding contact joint comprises a free joint to bring said retainer ring and said housing into sliding contact with each other.  
     
     
         3 . The polishing apparatus as recited in  claim 2 , wherein said free joint comprises a ball joint.  
     
     
         4 . A polishing apparatus comprising: 
 a polishing surface;    a top ring for holding a workpiece to be polished; and    a top ring shaft for pressing said top ring against said polishing surface, said top ring including: 
 a retainer ring for holding a peripheral edge portion of the workpiece,  
 a housing substantially in a form of a disk, said housing being connected to said top ring shaft, and  
 a joint interconnecting said retainer ring and said housing, said joint having a sufficient high rigidity in horizontal and vertical directions and a low flexural rigidity.  
   
     
     
         5 . The polishing apparatus as recited in  claim 4 , wherein said joint is disposed outside of a center of a radial width of said retainer ring.  
     
     
         6 . The polishing apparatus as recited in  claim 4 , wherein said joint has a cross-section constricted at a vertically central portion thereof.  
     
     
         7 . A polishing apparatus comprising: 
 a polishing surface;    a top ring for holding a workpiece to be polished; and    a top ring shaft for pressing said top ring against said polishing surface, said top ring including: 
 a retainer ring for holding a peripheral edge portion of the workpiece, and  
 a housing substantially in a form of a disk, said housing being connected to said top ring shaft,  
   wherein a rigidity of said housing is increased so that an inclination of a lower surface of said retainer ring is reduced with respect to said polishing surface when said top ring is pressed against said polishing surface.    
     
     
         8 . A polishing apparatus comprising: 
 a polishing surface; and    a top ring for holding a workpiece to be polished, said top ring including a retainer ring for holding a peripheral edge portion of the workpiece,    wherein said retainer ring includes: 
 a first ring member made of resin;  
 a second ring member made of metal or ceramic; and  
 a fastening tool for fastening said first ring member and said second ring member in a manner such that said first ring member and said second ring member can be detached as two layers in a vertical direction.  
   
     
     
         9 . The polishing apparatus as recited in  claim 8 , wherein said first ring member is brought into contact with said polishing surface.  
     
     
         10 . The polishing apparatus as recited in  claim 9 , wherein said first ring member includes particles serving as abrasive particles when said first ring member is scraped.  
     
     
         11 . The polishing apparatus as recited in  claim 8 , wherein said retainer ring further includes an engagement portion to fit said first ring member and said second ring member into each other.  
     
     
         12 . The polishing apparatus as recited in  claim 8 , wherein said retainer ring is configured such that said retainer ring can be regenerated merely by replacement of said first ring member.  
     
     
         13 . The polishing apparatus as recited in  claim 8 , where said fastening tool comprises a bolt.  
     
     
         14 . A retainer ring for holding a peripheral edge portion of a workpiece to be polished in a top ring for pressing the workpiece against a polishing surface and bringing the workpiece into sliding contact with the polishing surface, said retainer ring comprising: 
 a first ring member made of resin;    a second ring member made of metal or ceramic; and    a fastening tool for fastening said first ring member and said second ring member in a manner such that said first ring member and said second ring member can be detached as two layers in a vertical direction.