Carrier for double side polishing

Abstract

In a carrier of the invention, a thick ring-shaped support frame is provided at an outer periphery of a carrier body in which a workpiece housing hole for holding a workpiece is opened. An outer periphery of the support frame is provided with a teeth portion for engaging with driving gears for driving the carrier. The support frame is made of a different member from the carrier body. The carrier body is removably attached to the support frame by screws. The carrier body is made of a material suitable for holding a wafer. The support frame is made of a material suitable for engaging with driving gears for moving the carrier.

1 . A carrier for double side polishing which can be used in a single carrier type and compound movement type double side polisher in which the carrier holding a workpiece is held between upper and lower surface plates, and is moved with compound movement including a first movement in a circumferential direction and a second movement having a radial component, the carrier comprising: 
 a disk-shaped carrier body having an outer periphery and at least one opening for holding the workpiece; and    a ring-shape support frame provided at an outer periphery of the carrier body to support the carrier body,    wherein the support frame is thicker than the carrier body, and comprises a teeth portion at its periphery for engaging with driving gears of the double side polisher for driving the carrier.    
     
     
         2 . A carrier for double side polishing according to  claim 1 , wherein the support frame which is provided to support the carrier body is made of a member independent of the carrier body, and is removable from the carrier body.  
     
     
         3 . A carrier for double side polishing according to  claim 2 , wherein the support frame which is provided to support the carrier body is made of a material having different properties from the carrier body.  
     
     
         4 . A carrier for double side polishing according to  claim 1 , wherein an upper surface of the support frame is placed at a position higher than an upper surface of the carrier body.  
     
     
         5 . A carrier for double side polishing according to  claim 1 , wherein an upper surface of the support frame is placed at a position lower than an upper surface of the carrier body.  
     
     
         6 . A method for polishing a semiconductor wafer utilizing a carrier for double side polishing according to  claim 1.