Polishing method

Abstract

The polished object is prevented from sticking to the upper polishing mechanism wherein the sticking is a cause for the damages to the polished object and reduction of the yield. There is provided a double side polishing method comprising steps of: inserting an object between a pair of upper and lower polishing mechanisms and polishing the object by rotating or sliding the object therebetween, wherein an adsorption strength of a contact surface of the upper polishing mechanism onto the object is weaker than an adsorption strength of a contact surface of the lower polishing mechanism onto the object.

1 . A double side polishing method comprising the steps of: 
 inserting an object between a pair of upper and lower polishing mechanisms and    polishing the object by rotating or sliding the object therebetween,    wherein an adsorption strength of a contact surface of the upper polishing mechanism onto the object is weaker than an adsorption strength of a contact surface of the lower polishing mechanism onto the object.    
     
     
         2 . The double side polishing method according to  claim 1 , wherein a ratio of said adsorption strength of the contact surface of said upper polishing mechanism onto said object to said adsorption strength of the contact surface of said lower polishing mechanism onto said object is 0.95 or less.  
     
     
         3 . The double side polishing method according to  claim 1 , wherein a ratio of said adsorption strength of the contact surface of said upper polishing mechanism onto said object to said adsorption strength of the contact surface of said lower polishing mechanism onto said object is from 0.1 to 0.85.  
     
     
         4 . The double side polishing method according to  claim 1 , wherein a contact surface area of said upper polishing mechanism with said object is smaller than a contact surface area of said lower polishing mechanism with said object.  
     
     
         5 . The double side polishing method according to  claim 1 , wherein a contact surface of said upper polishing mechanism with said object comprises a groove.  
     
     
         6 . The double side polishing method according to  claim 1 , wherein a ratio of the contact surface area of said upper polishing mechanism with said object to the contact surface area of said lower polishing mechanism with said object is 0.99 or less.  
     
     
         7 . The double side polishing method according to  claim 1 , wherein a ratio of the contact surface area of said upper polishing mechanism with said object to the contact surface area of said lower polishing mechanism with said object is from 0.3 to 0.95.